Abstract:
A structure having single crystal islands in a dielectric substrate is described. The substrate has recesses formed in its surface to receive the single crystal bodies therein. By applying a temperature gradient across each of the bodies throughout the entire heating cycle, nucleation occurs only at a bottom point on each of the bodies when a vapor containing the material to be nucleated is passed over the bodies with the material of the bodies being molten. The single crystalline material can be, for example, silicon or germanium and the dielectric material can be, for example, a silicon dioxide glass or a mixed oxide ceramic.
Abstract:
A VAPOR PHASE EPITAXIAL PROCESS FOR FORMING A SUPERLATTICE STRUCTURE COMPRISING ALTERNATE LAYERS OF DIFFERENT SEMICONDUCTOR MATERIALS ON A SUBSTRATE. IN THE SUPERLATTICE, THE PROPORTION OF ONE COMPONENT IS CAUSED TO PERIODICALLY VARY FROM A DESIRED MAXIMUM TO A DESIRED MINIMUM OVER AN EXTREMELY SMALL PERIOD. FOR AN N COMPONENT SYSTEM, THIS IS ACCOMPLISHED BY FORMING A STREAM COMPRISING N-1 COOPONENTS AND INJECTING PULSES OF THE NTH COMPONENT IN A CARRIER GAS SEPARATED BY PULSES OF CARRIER GAS INTO THE N-1 COMPONENT STREAM, TO THEREBY PROVIDE AT THE SUBSTRATE ALTERNATE, DISCRETE BURSTS OF GAS COMPRISING N COMPONENTS AND N-1 COMPONENTS, RESPECTIVELY. BY CRITICALLY CONTROLLING DIFFUSION OF ADJACENT PULSES AND BURSTS, THE PROPORTION OF THE NTH COMPONENT IN THE SUPERLATTICE STRUCTURE CAN BE VARIED FROM A MAXIMUM TO A MINUMUM WITHIN AN EXTREMELY SMALL PERIOD. HIGH TEMPERATURE, VAPOR PHASE EPITAXIAL DEPOSITION APPARATUS FOR DEPOSITING SUCH A REPETITIVE SUPERLATTICE STRUCTURE: BASICALLY A PULSING CHAMBER TO RECEIVE THE N-1 COMPONENT STREAM; PULSING MEANS TO PERIODICALLY PULSE THE NTH COMPONENT INTO THE N-1 COMPONENT STREAM, WHEREBY THE BURSTS DESCRIBED ABOVE ARE FORMED; AND DEPOSITION MEANS CONTAINING A SUBSTRATE TO RECEIVE SAID BURSTS FOR THE FORMATION OF SAD SUPERLATTICE. ALL ELEMENTS ARE CORRELATED TO PERMIT DIFFUSION TO BE CRITICALLY CONTROLLED.