公开(公告)号：GB2259661A

公开(公告)日：1993-03-24

申请号：GB9119960

申请日：1991-09-18

Applicant: IBM

Inventor： ROBERTSON BRIAN L ,  MURRAY KENNETH S ,  BROWN JOHN ,  MCNEE JAMES

IPC: B23K3/06 ,  H05K3/12 ,  H05K3/34

Abstract: Solder is deposited on a printed circuit board 40 by melting the solder in a container 20. The container has a slot 240 for passage of solder and control means 230 actuable to alternately allow and prevent passage of solder through the slot. The slot is placed in contact with a stencil 60 and the control means is actuated to allow passage of solder through the slot. The stencil is moved relative to the container in a direction transverse of the slot to deposit solder on the printed circuit board via the stencil which moves synchronously.