公开(公告)号：CA2345433A1

公开(公告)日：2002-03-01

申请号：CA2345433

申请日：2001-04-27

Applicant: IBM

Inventor： FONTANA FULVIO ,  FARQUHAR DONALD S ,  CESANA MARIO L ,  BUTTURINI GIUSEPPE

IPC: G06F21/00 ,  G08B13/12 ,  H05K5/02 ,  H05K5/06

Abstract: A method and apparatus for forming a security enclosure having improved fold retention. In particular, the enclosure is formed by folding a flexible tamper responde nt cloth around an electronic assembly. An adhesive on the inner folded surfaces of the cloth temporarily retains the folds. The enclosure is then exposed to heat and pressure to promote improve d adhesion strength of the adhesive, thereby improving told retention.