Magnetic thin film recording head module

    公开(公告)号:GB2607768A

    公开(公告)日:2022-12-14

    申请号:GB202211981

    申请日:2021-01-06

    Applicant: IBM

    Abstract: An apparatus includes a module (204) having a first array of read transducers (216). A first electrical shielding layer (240) is positioned above the first array of read transducers (216). An array of write transducers (214) is positioned above the first electrical shielding layer (240). A second electrical shielding layer (242) is positioned above the array of write transducers (214). A second array of read transducers (216) is positioned above the second electrical shielding layer (242).

Patent Agency Ranking