公开(公告)号：CA2018496A1

公开(公告)日：1991-02-28

申请号：CA2018496

申请日：1990-06-07

Applicant: IBM

Inventor： BONNELL RALPH E ,  CASTELLO GEORGE C ,  HOEBENER KARL G

IPC: H05K3/30 ,  H05K3/34 ,  H05K13/04

Abstract: A process for double sided attachment of components (130) to a printed circuit board (100) is described wherein surface mount components (130) soldered to a first surface of the circuit board (backside) are, once the board (100) is inverted during reflow, retained in place only by force of molten solder surface tension.

公开(公告)号：CA2018496C

公开(公告)日：1992-12-22

申请号：CA2018496

申请日：1990-06-07

Applicant: IBM

Inventor： BONNELL RALPH E ,  CASTELLO GEORGE C ,  HOEBENER KARL G

IPC: H05K3/30 ,  H05K3/34 ,  H05K13/04

Abstract: IMPROVED METHOD OF ATTACHING ELECTRONIC COMPONENTS An improved method for double sided attachment of components to a printed circuit board is described wherein surface mount components soldered to a first surface of the circuit board (backside) are, once the board is inverted during reflow, retained in place only by force of molten solder surface tension.