公开(公告)号：JPH11330126A

公开(公告)日：1999-11-30

申请号：JP10855899

申请日：1999-04-15

Applicant: IBM

Inventor： PETER J BURFMAN ,  MARK G COURTNEY ,  SHARGE FALUKE ,  MARIO J INTERLANT ,  RAYMOND A JACKSON ,  GREGORY B MARTIN ,  SDIPTA K ROY ,  WILLIAM E SABIRINSKI ,  CATHLEEN A SATALTA

IPC: H01L23/12 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To obtain a solder structure part, having long fatigue life in the case of mutually combining plural substrates, especially in a second level such as a ball grid array(BGA) and a column grid array(CGA). SOLUTION: This solder structure part 10 has a solder inner core 11 and a metal layer 12 having wettability with respect to solder. Substrates 17, 22 are respectively provided with pads 18, 23, and the structure part 10 is connected to these pads 18, 23 through respective solder connection parts 19, 24. Since the inner core 11 is coated with the metal layer 12, the layer 12 reinforces the structure part 10, so that the distortion generated during the period in a through cycle is expanded uniformly to the ball, and the entire connection parts and the fatigue life of the structure part 10 can be extended.