公开(公告)号：FR2298814A1

公开(公告)日：1976-08-20

申请号：FR7539612

申请日：1975-12-17

Applicant: IBM

Inventor： LICLICAN LEO C ,  CHANG LEO S

IPC: G03G5/00 ,  G03G5/047 ,  G03G5/05 ,  G03G5/06 ,  H01L51/42 ,  G03G5/04

公开(公告)号：CA1155333A

公开(公告)日：1983-10-18

申请号：CA362579

申请日：1980-10-16

Applicant: IBM

Inventor： CHANG LEO S ,  DE MORE ANTHONY

IPC: B41J31/00 ,  B41J2/42 ,  B41J31/05 ,  B41M5/025 ,  B41M5/20 ,  B41M5/26 ,  B41M5/382 ,  B41J31/02

Abstract: A RIBBON CONFIGURATION FOR RESISTIVE RIBBON THERMAL TRANSFER PRINTING A resistive ribbon thermal transfer printing apparatus has an improved ribbon configuration. The ribbon contains a two-ply resistive element positioned on a conductive layer. The resistive element contains a top layer having a low resistance, for example 3x10-5.OMEGA. for making contact with the writing head and a bottom layer having a higher resistance, for example 1x10-3.OMEGA. in contact with the conductive layer for generating heat. The ratio of the resistance of the high resistance layer to the resistance of the low resistance layer, RH/RL, is 1.1 to 1000. An example of such a ribbon contains a top resistive layer of polyimide containing 35% conductive carbon, a bottom resistive layer of a SiO/Cr cermet (60%/40%), a stainless steel conductive layer and a Versamid ink layer. Versamid is a trade mark used to identify a linear polyimide having the following properties: melting point of 105.degree.C to 115.degree.C and a melt index at 150.degree.C of 20 to 30 poise. SA9-79-023