-
公开(公告)号：DE3273510D1
公开(公告)日：1986-11-06
申请号：DE3273510
申请日：1982-03-31
Applicant: IBM
Inventor： LOPEZ JORGE LUIS , CHOW WILLIAM WAI-CHUNG , HU PAUL YU-FEI , FIELDS JR
Abstract: The temperatur of a magnetic head assembly is reduced by active heat transfer accomplished by a thermoelectric cooling element (28) positioned between and in contact with a wall (20) of the head assembly housing (14) and a write head module (10) of the head assembly. The housing serves as a heat sink from which thermal energy is diffused.
-
公开(公告)号：DE3271964D1
公开(公告)日：1986-08-21
申请号：DE3271964
申请日：1982-02-10
Applicant: IBM
Abstract: A multielement magnetic head is formed with a closure section 30 having a nonmagnetic ceramic substrate 12 on which a thin layer of magnetic ferrite 20 is deposited and processed. The thin ferrite layer is cut to define the separate transducing elements 42 and data track separation. The closure section is joined to a wafer formed from a ferrite substrate 36 which carries thin film conductive coil means.
-
公开(公告)号：DE69111302T2
公开(公告)日：1996-03-07
申请号：DE69111302
申请日：1991-05-20
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , FENNEMA ALAN AUGUST
-
公开(公告)号：DE69111302D1
公开(公告)日：1995-08-24
申请号：DE69111302
申请日：1991-05-20
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , FENNEMA ALAN AUGUST
-
公开(公告)号：DE3481791D1
公开(公告)日：1990-05-03
申请号：DE3481791
申请日：1984-10-04
Applicant: IBM
-
Patent Agency Ranking
公开(公告)号：DE3278702D1
公开(公告)日：1988-07-28
申请号：DE3278702
申请日：1982-03-25
Applicant: IBM
Inventor： ARGUMEDO ARMANDO JESUS , CHOW WILLIAM WAI-CHUNG , FREEMAN ROBERT DAVID , KLECZKOWSKI STAWOMIR PETER
Abstract: Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stress fluctuation that occurs with temperature change. The clamping force of the leaf spring is precisely controlled.
-
公开(公告)号：DE69016269D1
公开(公告)日：1995-03-09
申请号：DE69016269
申请日：1990-05-03
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , FENNEMA ALAN AUGUST , FIORINO BENJAIN CARMEL , HENDERSON IAN EDWARD , KADLEC RONALD JAMES , ROBERTS SPENCER DONALD
IPC: G05D3/12 , G11B7/085 , G11B11/105 , G11B21/08
-
公开(公告)号：DE69016269T2
公开(公告)日：1995-07-13
申请号：DE69016269
申请日：1990-05-03
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , FENNEMA ALAN AUGUST , FIORINO BENJAIN CARMEL , HENDERSON IAN EDWARD , KADLEC RONALD JAMES , ROBERTS SPENCER DONALD
IPC: G05D3/12 , G11B7/085 , G11B11/105 , G11B21/08
-
公开(公告)号：DE3167958D1
公开(公告)日：1985-02-07
申请号：DE3167958
申请日：1981-09-16
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , DUNN LARRY PARK
-
公开(公告)号：DE3164561D1
公开(公告)日：1984-08-09
申请号：DE3164561
申请日：1981-07-21
Applicant: IBM
Inventor： CHOW WILLIAM WAI-CHUNG , FIELDS DAVIS STUART
Abstract: A multipletrack magnetic head (38) has a closure section (26) comprising a ceramic substrate (30) to one surface of which are bonded equal width, closely spaced ferrite blocks (28). The blocks are bonded together and to the substrate by glass (33). A ferrite wafer (32) is bonded to the side of the closure section by cement (34) to form transducing gaps for a multiplicity of spaced magnetic head elements. … Closure sections for such heads are cut from an assembly comprising a ceramic substrate to which are bonded two interdigitated ferrite pieces with alternating complementary slots and fingers, the fingers of one piece being in the slots of the other piece. The ferrite pieces are bonded together and to the substrate by glass bonding. Each closure section is joined to a ferrite wafer, so that the wafer and closure section define a transducing gap therebetween.
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.017 seconds)
