公开(公告)号：DE68915250D1

公开(公告)日：1994-06-16

申请号：DE68915250

申请日：1989-10-10

Applicant: IBM

Inventor： CHRISTIANSEN ROBERT ARNOLD ,  DIGIROLAMO JOEL ALAN

IPC: H05K1/18 ,  H01L21/60 ,  H01L25/16 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/32 ,  H05K3/40

Abstract: A copper supporting sheet (5) has holes (9) for connecting semiconductor chips (3) to surface mount components (27). A laminate of polyimide (7) has holes (13) corresponding to the supporting layer holes (9) with copper 15 covering those holes (13). In addition to crossing those holes (13), the copper 15 forms conventional circuit patterns. The side having circuit patterns is populated by surface mount techniques with components (27). The opposite side has silicon chips (3) attached to the copper sheet (5) adjacent to holes (9). Wires (17) are ultrasonically bonded to the chips (3) and extended to the inside of the holes (13) in the polyimide layer (7), where they are ultrasonically bonded to copper (15). Crossover connection of the circuit patterns (17a) are achieved using the same technique. The circuit board is densely populated and cost-effective, with good heat dissipation characteristics.

公开(公告)号：DE3577028D1

公开(公告)日：1990-05-10

申请号：DE3577028

申请日：1985-12-10

Applicant: IBM

Inventor： CHRISTIANSEN ROBERT ARNOLD ,  ROSE JR FRANK MARION ,  SMITH JAMES ROBERT ,  WOOSLEY KENNETH DAVID

IPC: H01R43/02 ,  B23K20/10 ,  B29C65/08 ,  B29C65/78 ,  H01R12/61 ,  H01R12/62 ,  H05K1/09 ,  H05K1/11 ,  H05K3/32 ,  H05K3/36 ,  H01R9/07

Abstract: Flexible flat ribbon cables (10, 12) with a polyester binder silver particle conductive ink (26) deposited on a heat bondable substrate (11, 13) are bonded to each other by applying ultrasonic energy to the cables (10, 12). The conductors (26) are bonded to form connections and are prevented from being deformed laterally to bridge to adjacent conductors due to preferential substrate bonding between adjacent conductors (26). Both apparatus for and the method of preferential substrate bonding are disclosed.

公开(公告)号：DE68915250T2

公开(公告)日：1994-11-17

申请号：DE68915250

申请日：1989-10-10

Applicant: IBM

Inventor： CHRISTIANSEN ROBERT ARNOLD ,  DIGIROLAMO JOEL ALAN

IPC: H05K1/18 ,  H01L21/60 ,  H01L25/16 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/32 ,  H05K3/40

Abstract: A copper supporting sheet (5) has holes (9) for connecting semiconductor chips (3) to surface mount components (27). A laminate of polyimide (7) has holes (13) corresponding to the supporting layer holes (9) with copper 15 covering those holes (13). In addition to crossing those holes (13), the copper 15 forms conventional circuit patterns. The side having circuit patterns is populated by surface mount techniques with components (27). The opposite side has silicon chips (3) attached to the copper sheet (5) adjacent to holes (9). Wires (17) are ultrasonically bonded to the chips (3) and extended to the inside of the holes (13) in the polyimide layer (7), where they are ultrasonically bonded to copper (15). Crossover connection of the circuit patterns (17a) are achieved using the same technique. The circuit board is densely populated and cost-effective, with good heat dissipation characteristics.