公开(公告)号：JPH0878617A

公开(公告)日：1996-03-22

申请号：JP20570195

申请日：1995-08-11

Applicant: IBM

Inventor： COCKERILL MARTHA A C ,  MALTABES JOHN G ,  O'CONNOR LORETTA J ,  VOLDMAN STEVEN HOWARD

IPC: H01L25/00 ,  H01L21/66 ,  H01L21/98 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

Abstract: PROBLEM TO BE SOLVED: To form a monolithic electronic module by a method, wherein a plurality of planers and arrays, having a plurality of integrated circuit chips, are formed, and the planers and the arrays are stacked. SOLUTION: After a dicing pattern, which positions each array on a wafer, is determined, transfer metal 15 is adhered on a wafer. The wafer is diced along cutting grooves 17 in accordance with the dicing pattern, and a plane and a array of IC chips are formed. The IC chip, the planer and the array are protected by an insulating material, and a bonding agent is applied to the surface of the insulating material. The array of an integrated circuit chip is connected to the rear surface of the next array. In this way, a monolithic electronic module can be formed by adhering each array to the adjacent array.