公开(公告)号：AU5561696A

公开(公告)日：1997-11-07

申请号：AU5561696

申请日：1996-04-19

Applicant: IBM

Inventor： DAREKAR VIJAY ,  BRUSIC VLASTA ,  SARAF RAVI ,  GAYNES MICHAEL

IPC: B05D3/02 ,  B05D7/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  C23C22/02 ,  C23C22/68 ,  C23C30/00 ,  C23F11/14 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.