公开(公告)号：SG48462A1

公开(公告)日：1998-04-17

申请号：SG1996010224

申请日：1996-07-06

Applicant: IBM

Inventor： PAPATHOMAS KONSTANINOS I ,  FUERNISS STEPHEN JOSEPH ,  DITTRICH DEBORAH LYNN ,  WANG DAVID WEI

IPC: C08G59/18 ,  C08F2/48 ,  C08G59/00 ,  C08G59/68 ,  C08G73/02 ,  H01L23/29 ,  H01L23/31 ,  H05K3/28 ,  H05K3/34 ,  H01L23/48

Abstract: An electronic package assembly where a low profile integrated circuit chip package is soldered to an organic (e.g., epoxy resin) substrate, e.g., a printed circuit board or card, the projecting conductive leads of the integrated circuit chip package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with ultraviolet photocured encapsulant material (e.g., an epoxy resin or a cyanate with a photoinitiator and silica) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder.