公开(公告)号：US3596230A

公开(公告)日：1971-07-27

申请号：US3596230D

申请日：1969-10-15

Applicant: IBM

Inventor： ECKER MARIO E

IPC: H01R24/00 ,  H01R12/88 ,  H01R13/62

CPC classification number: H01R12/88

Abstract: This specification describes a connector which has a plurality of flexible U-shaped elements each with one arm of the U forming a contact carrying member for making electrical connections to lands on circuit boards inserted into the U and the other arm of the U forming a helper member for aiding in exerting the contact force on the lands. The position of the contact carrying members and the helper members is alternated from one side of the circuit board to the other so that the contacts engage lands on both sides of the circuit board. On each side of the circuit board, the members are positioned against the board while the helper members are spaced away from the board so that helper members and contact members form channels between them on both sides of the board. These channels each contain a floating force member which transfers a portion of the force exerted on the contact carrying members by the lands to the helper members.

公开(公告)号：CA915280A

公开(公告)日：1972-11-21

申请号：CA915280D

Applicant: IBM

Inventor： ECKER MARIO E

IPC: H01R13/62

公开(公告)号：BR9201348A

公开(公告)日：1992-12-01

申请号：BR9201348

申请日：1992-04-13

Applicant: IBM

Inventor： ECKER MARIO E ,  JACOBOWITZ LAWRENCE

IPC: G02B6/42 ,  H04B10/12 ,  H04B10/135 ,  H04B10/14 ,  H04B10/2581

Abstract: The present invention relates to an optical fiber interface and a method for making the same. A Thermal Conduction Module or TCM (10), comprises a lower frame (12), an upper frame (16), sandwiching a seal frame (14), are held together by bolts (18). Usually a cold plate (17), having a number of coolant channels (21), is secured to the upper surface of the upper frame (16), A substrate (40), having stepped edge (42), and having semiconductor chips (50), thereon, is secured between the ledge (41), of the lower frame (12), and the extension of seal frame (14), with a gasket (46), therebetween. Heat exchange elements (52) transfer the heat generated by the chips (50), to the upper frame (16). A retainer (51), holds the heat exchange elements (52), in place, and is also used to provide the guide grooves and securing means for an optical fiber (23). Cooling devices where there is no retainer, can be modified to provide means for guiding and securing the optical fiber (23), from the exterior of the TCM (10) , to an optoelectronic device on the substrate (40). A fluid tight seal for the chips (50), that are on the substrate 40, is achieved by means of gaskets (46, 48). An optical fiber mounting assembly (20), provides the interface between the multi-fiber optical cable (25), and the TCM (10). Face plate (22), keeper (32), wave washer (31), retainer (30), and shoulder (28), are various components of the optical fiber mounting assembly (20), that normally protrude out of the TCM (10). The optical fiber mounting assembly (20), may be located between any adjacent pair of bolts (18), along the sides of the TCM (10). Therefore, any side of the TCM (10), may then accommodate (N-1) optical fiber mounting assemblies (20), where N = number of bolts along the given side of the TCM (10). Each optical fiber mounting assembly (20), can have a multi-fiber optical cable (25), having one or more optical fibers (23) having a core of a first refractive index material with a cladding of a second refractive index material and a protective jacket which is typically of a polymeric material.

公开(公告)号：CA2061299A1

公开(公告)日：1992-10-30

申请号：CA2061299

申请日：1992-02-17

Applicant: IBM

Inventor： ECKER MARIO E ,  JACOBOWITZ LAWRENCE

IPC: G02B6/42 ,  H04B10/12 ,  H04B10/135 ,  H04B10/14 ,  H04B10/2581

Abstract: The present invention relates to an optical fiber interface and a method for making the same. A Thermal Conduction Module or TCM (10), comprises a lower frame (12), an upper frame (16), sandwiching a seal frame (14), are held together by bolts (18). Usually a cold plate (17), having a number of coolant channels (21), is secured to the upper surface of the upper frame (16), A substrate (40), having stepped edge (42), and having semiconductor chips (50), thereon, is secured between the ledge (41), of the lower frame (12), and the extension of seal frame (14), with a gasket (46), therebetween. Heat exchange elements (52) transfer the heat generated by the chips (50), to the upper frame (16). A retainer (51), holds the heat exchange elements (52), in place, and is also used to provide the guide grooves and securing means for an optical fiber (23). Cooling devices where there is no retainer, can be modified to provide means for guiding and securing the optical fiber (23), from the exterior of the TCM (10) , to an optoelectronic device on the substrate (40). A fluid tight seal for the chips (50), that are on the substrate 40, is achieved by means of gaskets (46, 48). An optical fiber mounting assembly (20), provides the interface between the multi-fiber optical cable (25), and the TCM (10). Face plate (22), keeper (32), wave washer (31), retainer (30), and shoulder (28), are various components of the optical fiber mounting assembly (20), that normally protrude out of the TCM (10). The optical fiber mounting assembly (20), may be located between any adjacent pair of bolts (18), along the sides of the TCM (10). Therefore, any side of the TCM (10), may then accommodate (N-1) optical fiber mounting assemblies (20), where N = number of bolts along the given side of the TCM (10). Each optical fiber mounting assembly (20), can have a multi-fiber optical cable (25), having one or more optical fibers (23) having a core of a first refractive index material with a cladding of a second refractive index material and a protective jacket which is typically of a polymeric material.

公开(公告)号：CA2061328C

公开(公告)日：1995-02-14

申请号：CA2061328

申请日：1992-02-17

Applicant: IBM

Inventor： JACOBOWITZ LAWRENCE ,  ECKER MARIO E

IPC: G06F1/18 ,  H01P1/04 ,  H01R23/00 ,  H01R43/00 ,  H01R13/52 ,  H01R33/76

Abstract: The present invention relates generally to a new interface and a method for making the same, and more particularly, to an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.

公开(公告)号：DE3381129D1

公开(公告)日：1990-02-22

申请号：DE3381129

申请日：1983-05-06

Applicant: IBM

Inventor： ECKER MARIO E ,  OLSON LEONARD T

IPC: H01L23/52 ,  H01L23/40 ,  H01L23/538 ,  H01L25/00

Abstract: @ A multi-level integrated circuit packaging system has a primary support frame (N), an array of secondary support frames (H) mounted in said primary support frame and an array of single chip carriers associated with each secondary support frame. An integrated circuit is encapsulated in each single chip carrier, which has an insulated wiring pattern with EC wells and delete lands (d). The secondary and primary support frames also have EC pads so that a change capability exists to any electrical signal path terminating on the chip.

公开(公告)号：CA2061299C

公开(公告)日：1998-09-22

申请号：CA2061299

申请日：1992-02-17

Applicant: IBM

Inventor： ECKER MARIO E ,  JACOBOWITZ LAWRENCE

IPC: G02B6/42 ,  H04B10/12 ,  H04B10/135 ,  H04B10/14 ,  H04B10/2581

Abstract: The present invention relates generally to a new interface and a method for making the same, and more particularly, to an optical fiber interface and a method for making the same. On a substrate having semiconductors, a receiver/transmitter connection is provided to interface with an optical fiber. Integral means for the fiber alignment, support and transit through a sealed environment is also provided. The substrate having the receiver/transmitter secured to it with the optical fiber end, is then enclosed in a housing.

公开(公告)号：CA989494A

公开(公告)日：1976-05-18

申请号：CA148606

申请日：1972-08-03

Applicant: IBM

Inventor： ECKER MARIO E

IPC: H01R12/87 ,  H01R13/46 ,  H01R24/00

Abstract: An electrical connector is provided which prevents damage to the edge of the card by the contact points during initial insertion but allows for wiping the circuit card at the contact terminal areas. The connector operates with two basic components, a resilient U-shaped element containing points for electrically contacting the circuit card and a rigid-conformal housing which controls the point of insertion at which electrical contact will take place as well as acts to hold the circuit card tightly in place after insertion.