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    2.
    发明专利
    未知

    公开(公告)号：DE2847070A1

    公开(公告)日：1979-05-10

    申请号：DE2847070

    申请日：1978-10-28

    Applicant: IBM

    Inventor： BABCOCK THOMAS CHARLES ,  ELLIS THERON LARUE ,  MAJKA HENRY CASIMER

    IPC: H05K3/46 ,  C23G5/02 ,  H05K3/38 ,  H05K3/22

    Abstract: Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing.

    METHOD FOR FABRICATING MULTILAYER LAMINATED PRINTED CIRCUIT BOARDS
    5.
    发明专利
    METHOD FOR FABRICATING MULTILAYER LAMINATED PRINTED CIRCUIT BOARDS 未知

    公开(公告)号：DE3278193D1

    公开(公告)日：1988-04-07

    申请号：DE3278193

    申请日：1982-11-23

    Applicant: IBM

    Inventor： ELLIS THERON LARUE

    IPC: B32B15/08 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46

    Abstract: A laminate for a laminated multilayer circuit board incorporates as a constituent member the plating layer (11) from a peel-apart temporary base (12) used in the fabrication of the laminate. The layer (11), with its one surface (11a) superimposed on the base (12), has additively plated to its opposite surface (11b) individual conductors (14) and is subsequently personalized in register with the pattern of the plated conductor circuitry. The personalized layer (11) and the plated conductors (14) are embedded in a dielectric layer (15), the superimposed surface (11a) being flush mounted in the dielectric layer (15). The base (12) has a rough-like surface profile characteristic that imparts at least a conformal surface profile characteristic in the superimposed surface (11a) of the plating layer (11) which in turn provides improved adherence of this superimposed flush mounted surface, when subsequently exposed by the removal of the peel-apart base (12), to another dielectric layer (17) thereafter laminated to the embedding dielectric layer (15) to inhibit delamination between the two dielectric layers. Preferably, the base (12) also imparts a conformal profile surface characteristic either to the plating surface (11b) to improve the plating bond between the plating layer (11) and conductors (14), and / or to the laminating surface (15a) of the embedding dielectric layer (15) to improve the lamination bond between the two dielectric layers (15, 17), which combine with the conformal characteristic of the plating layer's (11) flush mounted surface (11a)to inhibit synergistically delamination between the two dielectric layers.

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