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公开(公告)号：DE69011223D1
公开(公告)日：1994-09-08
申请号：DE69011223
申请日：1990-05-07
Applicant: IBM
Inventor： DRANCHAK DAVID WILLIAM , ENGLE DAVID ERWIN , KNIGHT ALAN DOUGLAS
Abstract: An electrical connector assembly including a housing (21), a flexible circuit (41) located within the housing and including first and second terminals thereon, a carriage (25) movably positioned within the housing and designed for having a circuit board (13) inserted therein, actuation means (61) connected to the carriage to cause it to move and occupy first and second positions within the housing, and biasing means in the form of a pair of leaf springs (73) which continuously exert biasing force against the carriage during its positioning within the invention's housing. As defined herein, contact is possible between a plurality of individual contact elements which form part of the circuit board and respective terminals located at one end portion of the flexible circuit. Second terminals located at the other end of the flexible circuit are designed for mating with and contacting respective conductors located on the second circuit device. Positive interconnection is thus possible between high density arrays of contact members in a compact structure.
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公开(公告)号：DE69214334D1
公开(公告)日：1996-11-14
申请号：DE69214334
申请日：1992-03-13
Applicant: IBM
Inventor： BENTLAGE JAMES ROBERT , ENGLE DAVID ERWIN , MARINER GEOFFREY RANDOLPH , SQUIRES JOHN JAY , WILLIAMS JOHN HENRY
IPC: H01L25/00 , H01L23/32 , H01L23/498 , H01R12/62 , H01R12/79 , H01R13/24 , H05K1/14 , H05K3/36 , H05K7/10
Abstract: An electronic package (10) including a first circuitized substrate (13) (e.g., printed circuit board) and a flexible circuitized substrate (27) wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member (50) and associated frame member (33), the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members (21) are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp (67) members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible sub-trate.
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Patent Agency Ranking
公开(公告)号：DE69011223T2
公开(公告)日：1995-03-09
申请号：DE69011223
申请日：1990-05-07
Applicant: IBM
Inventor： DRANCHAK DAVID WILLIAM , ENGLE DAVID ERWIN , KNIGHT ALAN DOUGLAS
Abstract: An electrical connector assembly including a housing (21), a flexible circuit (41) located within the housing and including first and second terminals thereon, a carriage (25) movably positioned within the housing and designed for having a circuit board (13) inserted therein, actuation means (61) connected to the carriage to cause it to move and occupy first and second positions within the housing, and biasing means in the form of a pair of leaf springs (73) which continuously exert biasing force against the carriage during its positioning within the invention's housing. As defined herein, contact is possible between a plurality of individual contact elements which form part of the circuit board and respective terminals located at one end portion of the flexible circuit. Second terminals located at the other end of the flexible circuit are designed for mating with and contacting respective conductors located on the second circuit device. Positive interconnection is thus possible between high density arrays of contact members in a compact structure.
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公开(公告)号：DE69124951D1
公开(公告)日：1997-04-10
申请号：DE69124951
申请日：1991-12-11
Applicant: IBM
Inventor： CHAPIN FLETCHER WILLIAM , DRANCHAK DAVID WILLIAM , ENGLE DAVID ERWIN
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公开(公告)号：DE68915973T2
公开(公告)日：1994-12-01
申请号：DE68915973
申请日：1989-11-10
Applicant: IBM
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公开(公告)号：DE69214334T2
公开(公告)日：1997-04-10
申请号：DE69214334
申请日：1992-03-13
Applicant: IBM
Inventor： BENTLAGE JAMES ROBERT , ENGLE DAVID ERWIN , MARINER GEOFFREY RANDOLPH , SQUIRES JOHN JAY , WILLIAMS JOHN HENRY
IPC: H01L25/00 , H01L23/32 , H01L23/498 , H01R12/62 , H01R12/79 , H01R13/24 , H05K1/14 , H05K3/36 , H05K7/10
Abstract: An electronic package (10) including a first circuitized substrate (13) (e.g., printed circuit board) and a flexible circuitized substrate (27) wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member (50) and associated frame member (33), the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members (21) are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp (67) members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible sub-trate.
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公开(公告)号：DE68915973D1
公开(公告)日：1994-07-14
申请号：DE68915973
申请日：1989-11-10
Applicant: IBM
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