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1.发明公开RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) 有权外壳用于高频（HF）带集成APERTURGEKOPPELTER贴片天线或集成电路（IC） 集成孔径贴片天线
公开(公告)号：EP2253045A4
公开(公告)日：2011-03-23
申请号：EP08872709
申请日：2008-12-30
Applicant: IBM
Inventor： FLOYD BRIAN , LIU DUIXIAN
CPC classification number: H01Q23/00 , H01L23/66 , H01L2223/6677 , H01L2224/16225 , H01L2924/09701 , H01Q1/2283 , H01Q1/38 , H01Q9/0457
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