公开(公告)号：DE69026055T2

公开(公告)日：1996-10-02

申请号：DE69026055

申请日：1990-12-20

Applicant: IBM

Inventor： FRANKENY RICHARD FRANCES ,  HERMANN KARL

IPC: H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L25/065

公开(公告)号：DE69026055D1

公开(公告)日：1996-04-25

申请号：DE69026055

申请日：1990-12-20

Applicant: IBM

Inventor： FRANKENY RICHARD FRANCES ,  HERMANN KARL

IPC: H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L23/473 ,  H01L25/065

公开(公告)号：DE69007452T2

公开(公告)日：1994-10-06

申请号：DE69007452

申请日：1990-12-20

Applicant: IBM

Inventor： FRANKENY RICHARD FRANCES ,  HERMAN KARL

IPC: H01L23/498 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

Abstract: A multi-level circuit structure (50) is provided which includes a plurality of overlying substrates, each having at least one conductive core (10). A plurality of imprinted deformations are formed in each substrate, each deformation having a convex surface (14) and a concave surface (16). Dielectric coatings (18) are utilized to provide insulation between adjacent substrates and by selectively placing a conductive mass between selected overlying imprinted deformations an electrical connection may be formed between adjacent imprinted deformations wherein selected portions of one substrate may be electrically coupled to selected portions of a second substrate.

公开(公告)号：DE69007452D1

公开(公告)日：1994-04-21

申请号：DE69007452

申请日：1990-12-20

Applicant: IBM

Inventor： FRANKENY RICHARD FRANCES ,  HERMAN KARL

IPC: H01L23/498 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46

Abstract: A multi-level circuit structure (50) is provided which includes a plurality of overlying substrates, each having at least one conductive core (10). A plurality of imprinted deformations are formed in each substrate, each deformation having a convex surface (14) and a concave surface (16). Dielectric coatings (18) are utilized to provide insulation between adjacent substrates and by selectively placing a conductive mass between selected overlying imprinted deformations an electrical connection may be formed between adjacent imprinted deformations wherein selected portions of one substrate may be electrically coupled to selected portions of a second substrate.