-
公开(公告)号：WO0247176A2
公开(公告)日：2002-06-13
申请号：PCT/GB0105188
申请日：2001-11-23
Inventor： GHOSHAL UTTAM SHYAMALINDU , ROBINSON ERROL WAYNE
Abstract: A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement and a second thermoelement electrically coupled to the first thermoelement. An array of first tips are in close physical proximity to, but not necessarily in physical contact with, the first thermoelement at a first set of discrete points. An array of second tips are in close physical proximity to, but not necessarily in physical contact with, the second thermoelement at a second set of discrete points. The arrays of first and second tips are constructed from metal, thus reducing parasitic resistances.
Abstract translation: 提供了一种提高效率的热电装置。 在一个实施例中，热电装置包括电耦合到第一热电偶的第一热电偶和第二热电元件。 在第一组离散点处，第一尖端的阵列与第一热电偶紧密物理上接近但不一定与物理接触。 在第二组离散点处，第二尖端的阵列与第二热电元件接近物理接近但不一定与物理接触。 第一和第二尖端的阵列由金属构成，从而减少寄生电阻。
-
公开(公告)号：WO0247178A3
公开(公告)日：2003-09-12
申请号：PCT/GB0105195
申请日：2001-11-23
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: A thermoelectric device with improved efficiency is provided. In one embodiment, the thermoelectric device includes an electrical conductor thermally coupled to a cold plate and a thermoelement electrically coupled to the electrical conductor. The thermoelement is constructed from a thermoelectric material and has a plurality of tips through which the thermoelement is electrically coupled to the electrical conductor. The thermoelectric tips provide a low resistive connection while minimizing thermal conduction between the electrical conductor and the thermoelement.
Abstract translation: 提供了一种提高效率的热电装置。 在一个实施例中，热电装置包括热耦合到冷板的电导体和电耦合到电导体的热电元件。 热电元件由热电材料构成，并具有多个尖端，热电偶通过该尖端电耦合到电导体。 热电尖端提供低电阻连接，同时最小化电导体和热电元件之间的热传导。
-
公开(公告)号：WO0247177A3
公开(公告)日：2002-12-05
申请号：PCT/GB0105193
申请日：2001-11-23
Inventor： GHOSHAL UTTAM SHYAMALINDU , CORDES STEVEN , DIMILIA DAVID , DOYLE JAMES , SPEIDELL JAMES
Abstract: A thermoelectric device with enhanced structured interfaces for improved cooling efficiency is provided. In one embodiment, the thermoelectric device includes a first thermoelement comprising a superlattice of p-type thermoelectric material and a second thermoelement comprising superlattice of n-type thermoelectric material. The first and second thermoelements are electrically coupled to each other. The planer surface of the first thermoelement is proximate to, without necessarily being in physical contact with, a first array of electrically conducting tips at a discrete set of points such that electrical conduction between the planer surface of the first thermoelement and the first array of electrically conducting tips is facilitated while thermal conductivity between the two is retarded. A planer surface of the second thermoelement is proximate to, without necessarily being in physical contact with, a second array of electrically conducting tips at a discrete set of points such that electrical conduction between the electrically conducting tips and the planer surface of the second thermoelement is facilitated while thermal conduction between the two is retarded. The electrically conducting tips are coated with a material that has the same Seebeck coefficient as the material of the nearest layer of the superlattice to the tip.
Abstract translation: 提供具有增强的结构化界面以提高冷却效率的热电装置。 在一个实施例中，热电装置包括包含p型热电材料的超晶格的第一热电元件和包含n型热电材料的超晶格的第二热电元件。 第一和第二热电元件彼此电连接。 第一热电元件的平面表面在不连续的一组点处与第一导电尖端阵列接近，而不必与其物理接触，使得第一热电元件的平面表面和第一电气电极阵列之间的电传导 导电尖端被促进，而两者之间的热传导被阻滞。 第二热电元件的平面表面在不连续的一组点处与第二导电尖端阵列接近，而不需要物理接触，使得导电尖端和第二热电元件的平面表面之间的电传导是 而两者之间的热传导被推迟。 导电尖端涂有塞贝克系数与最接近尖端超晶格层的材料相同的材料。
-
公开(公告)号：WO2004019192A3
公开(公告)日：2004-09-10
申请号：PCT/EP0308486
申请日：2003-07-10
Applicant: IBM , COMPANIE IBM FRANCE
Inventor： BURNS JEFFREY L , DRAKE ALAN J , GHOSHAL UTTAM SHYAMALINDU , NOWKA KEVIN J
CPC classification number: H03B5/1212 , H03B5/1228 , H03K3/354
Abstract: A system and integrated circuit (die) including a clock generator that includes an on-chip inductor and uses the inherent capacitance of the load to generate a sinusoidal clock signal. The inductor is connected between a current source and an inverting switch. The output of the switch is a substantially sinusoidal signal that connected directly to at least a portion of the clock driven circuits without intermediate buffering. In the preferred embodiment, the clock generator is a dual phase design that includes a pair of cross-coupled MOSFET's, a pair of solid state on-chip inductors, and a current source. Each of the on-chip inductors is connected between the current source and the drain of one of the MOSFET's. The outputs of the clock generator are provided directly to the clock inputs of at least a portion of the clock driven circuits on the die. In this embodiment, the frequency of the clock generator output signal is predominantly determined by the inductance of the inductive elements and the capacitance of the clock driven circuitry. This design eliminates the need for incorporating distinct capacitor elements in the clock generator itself and produces a clock generator in which a significant portion of the power oscillates between the generator's inductive elements and the capacitive elements of the load thereby reducing the power required to be supplied by the current source.
Abstract translation: 一种包括时钟发生器的系统和集成电路（芯片），其包括片上电感器并且使用负载的固有电容来产生正弦时钟信号。 电感连接在电流源和反相开关之间。 开关的输出是基本上正弦信号，其直接连接到时钟驱动电路的至少一部分而没有中间缓冲。 在优选实施例中，时钟发生器是双相设计，其包括一对交叉耦合MOSFET，一对固态片上电感器和电流源。 每个片上电感器连接在MOSFET之一的电流源和漏极之间。 时钟发生器的输出被直接提供给芯片上至少一部分时钟驱动电路的时钟输入。 在该实施例中，时钟发生器输出信号的频率主要由电感元件的电感和时钟驱动电路的电容决定。 该设计消除了在时钟发生器本身中并入不同的电容器元件并产生时钟发生器的需要，其中大部分功率在发电机的感应元件和负载的电容元件之间振荡，从而减少由 当前来源。
-
5.发明申请THERMOELECTRIC SPOT COOLERS FOR RF AND MICROWAVE COMMUNICATION INTEGRATED CIRCUITS 审中-公开用于射频和微波通信集成电路的电热点冷却器
公开(公告)号：WO0249105A3
公开(公告)日：2002-12-05
申请号：PCT/GB0105469
申请日：2001-12-11
Inventor： GHOSHAL UTTAM SHYAMALINDU
IPC: H01L23/38 , H01L23/522 , H01L35/00 , H01L23/66
CPC classification number: H01L23/38 , H01L23/5227 , H01L35/00 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.
Abstract translation: 提供一种用于冷却集成电路内的选定元件的装置，例如用于射频集成电路中的有源晶体管或无源电路元件。 在一个实施例中，冷却装置包括热耦合到靠近集成电路元件的区域的冷板，热耦合到冷板的热电冷却器; 以及热耦合到热电冷却器的热板。 通过冷板将热量从集成电路元件移除，并通过热电冷却器传递到热板。 在一种形式中，热板被定位或耦合到集成电路的外表面，使得从集成电路元件传输到环境的热量被散发到集成电路周围的大气中。 在另一种形式中，热板被嵌入集成电路基板中以局部地冷却集成电路的元件，同时将热量倾倒到基板中。
-
Patent Agency Ranking
公开(公告)号：JPH11317481A
公开(公告)日：1999-11-16
申请号：JP35033698
申请日：1998-12-09
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: PROBLEM TO BE SOLVED: To overcome basic restrictions in conventional thermoelectric cooling by applying dynamic modulation of a plurality of switches respectively to power and forming a thermoelectric conductive path connecting thermoelectric elements to the power supply and a cold sink. SOLUTION: Thermoelectric element dynamic is used with pulse power and a plurality of selectively operated heat reacting switches. In a device and a method for cooling subatmosphere, Peltier elements are operated dynamically by the use of power pulses. The heat path between the cold side and the hot side of a thermoelectric element 1 responds to thermal dynamics, so that the conductivity state is selectively switched on and off. The switch-type heat connection tuned relatively with electrical and thermo-dynamics of Peltier elements improves efficiency substantially by Joule heating and conductive heat transfer loss that otherwise affect heat transfer of the net.
-
公开(公告)号：JP2002231868A
公开(公告)日：2002-08-16
申请号：JP2001352989
申请日：2001-11-19
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus for mounting dense chips using a heat pipe and a thermoelectronic cooler. SOLUTION: The apparatus includes an evaporator region, a condenser region and a capillary region. The evaporator region includes at least one hot point element for conducting heat from a thermal source to a transport fluid. The transport fluid changes a state and becomes vapor when heated. The vapor moves to the condenser region through vapor channels and dissipates heat to the heat sink and returns to a fluid (condensed transport fluid) again. Then the condensed transport fluid returns to the evaporator region by a capillary force and the capillary formed into capillary structure. The capillary formed into the capillary structure makes a dendritic shape or a fractal shape. In addition, the apparatus can include a flexibility region. The apparatus can circumferentially be bent around corners and an edges.
-
公开(公告)号：JP2000252398A
公开(公告)日：2000-09-14
申请号：JP2000047033
申请日：2000-02-24
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: PROBLEM TO BE SOLVED: To obtain a thermoelectric cooling system for thermoelectrically cooling an IC device by giving a limited current pulse to a thermoelectric element to effectively thermally conduct a variable current source between the element and a heat sink. SOLUTION: A Peltier unit 21 can be connected to a low temperature sink 25 through a lump-like substance and a thermal switch S1. The unit 21 is also connected as a heat route having a small thermal resistance to a high temperature sink 26. Further, a variable current source 27 supplies a current to the unit 21. Since the unit 21 has a very small resistance, even when a voltage across the unit 21 is several mV, the current of the order of 1 ampere is generated. When the current passes the unit 21, the unit 21 generates thermal conduction to a boundary between the sink 25 and the sink 26. The thermal conduction of the unit 21 is utilized to cool the sink 26 and further to cool an IC device.
-
公开(公告)号：JPH11330366A
公开(公告)日：1999-11-30
申请号：JP4659799
申请日：1999-02-24
Applicant: IBM
Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: PROBLEM TO BE SOLVED: To provide a method and apparatus for forming an improved inductor capable of forming in an integrated circuit chip and capable of being adapted to be used with an electronic oscillator. SOLUTION: A composite inductor 400 is formed in a substrate, wherein the inductor comprises at least a first coil 42 having first coil inductance and first coil resistance, and a second coil 404 having second coil inductance and second coil resistance. The first coil 402 and the second coil 404 are formed in the substrate so as to generate new inductance that is related to the first coil and that is larger than the first inductance at the time when a current in the first coil 402 and a current in the second coil 404 match to each other. Thus apparatus is used to form an oscillator in an integrated circuit, wherein the apparatus achieves to form the electronic oscillator by electrically connecting to at least a capacitor in the substrate.
-
公开(公告)号：JP2009021593A
公开(公告)日：2009-01-29
申请号：JP2008177058
申请日：2008-07-07
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： GHOSHAL UTTAM SHYAMALINDU
Abstract: PROBLEM TO BE SOLVED: To provide a thermoelectric device and a thermal element for cooling an object. SOLUTION: The thermal device is provided with a first part 250 of a thermal element in thermal contact with a heated plate and a second part 210, 212 of the thermal element in thermal contact with a cooled plate, with one of the two parts of the thermal element provided with a plurality of tips 216 and the other of the two parts of the thermal element provided with flat faces, in which the plurality of tips 216 and the flat faces are arranged in adjoining positions to provide an electric connection. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种用于冷却物体的热电装置和热元件。 解决方案：热装置设置有与加热板热接触的热元件的第一部分250和与冷却板热接触的热元件的第二部分210,212，其中两个 设置有多个尖端216的热元件部分和热元件的两个部分中的另一个设置有平面，其中多个尖端216和平面布置在邻接位置以提供电连接。 版权所有（C）2009，JPO＆INPIT
-
-
-
-
-
-
-
-
-
Search Results
31
records
(took 0.016 seconds)
