公开(公告)号：DE69205385T2

公开(公告)日：1996-05-30

申请号：DE69205385

申请日：1992-10-19

Applicant: IBM

Inventor： GUTIERREZ BARBARA LARISA ,  SICKLER JANET M

IPC: B23K35/36 ,  H05K3/34 ,  B23K35/363

Abstract: A no-clean, thermally dissipated soldering flux is shown which includes hydroabietal alcohol as a flux base, an organic activator and an organic diluent. The hydroabietal alcohol provides a tacky medium which holds a precisely aligned chip in place both during placement and reflow. The nature of the formula renders a reducing atmosphere unnecessary. The composition is thermally dissipated during soldering and leaves no undesirable residue which would require a post-cleaning step.

公开(公告)号：DE69205385D1

公开(公告)日：1995-11-16

申请号：DE69205385

申请日：1992-10-19

Applicant: IBM

Inventor： GUTIERREZ BARBARA LARISA ,  SICKLER JANET M

IPC: B23K35/36 ,  H05K3/34 ,  B23K35/363

Abstract: A no-clean, thermally dissipated soldering flux is shown which includes hydroabietal alcohol as a flux base, an organic activator and an organic diluent. The hydroabietal alcohol provides a tacky medium which holds a precisely aligned chip in place both during placement and reflow. The nature of the formula renders a reducing atmosphere unnecessary. The composition is thermally dissipated during soldering and leaves no undesirable residue which would require a post-cleaning step.