公开(公告)号：DE69112134T2

公开(公告)日：1996-05-02

申请号：DE69112134

申请日：1991-05-01

Applicant: IBM

Inventor： HAJ-ALI-AHMADE JAVAD ,  FRANKENY RICHARD FRANCIS ,  HERMANN KARL

IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01L23/433 ,  H01L25/00 ,  H01L25/065 ,  H05K5/00 ,  H05K7/02 ,  H01L25/10

Abstract: An electronic circuit packaging module (12) includes a lower substrate, (16), an upper cooling unit (18) and a frame (12) disposed therebetween. The substrate (16) carries a plurality of integrated circuit chips (26) with lead-outs to a plurality of downwardly protruding dimpled contact points (50) disposed about the substrate periphery. The frame (12) includes a plurality of insulative inserts (14) about its periphery having conductive pins (34) each with a lower extension (38) extending below the insert and an upper contact point (36) recessed within the insert. The cooling unit (18) includes a plurality of fluid bags (22) each in contact with a respective chip (26) on the substrate (16) for thermal management. A plurality of such modules (10) are stacked in vertical registry whereby each downwardly protruding dimple (50) of a module (10) extends into a respective insert recess (36) of an adjacent module (10) therebelow. Electrical contactis thus effected between the respective dimples (50) on the lower surface of the upper module (10) and respective upper contact points of the recessed pins (36) on the upper surface of the cover module. (10).

公开(公告)号：DE69112134D1

公开(公告)日：1995-09-21

申请号：DE69112134

申请日：1991-05-01

Applicant: IBM

Inventor： HAJ-ALI-AHMADE JAVAD ,  FRANKENY RICHARD FRANCIS ,  HERMANN KARL

IPC: H01L23/473 ,  H01L23/40 ,  H01L23/42 ,  H01L23/433 ,  H01L25/00 ,  H01L25/065 ,  H05K5/00 ,  H05K7/02 ,  H01L25/10

Abstract: An electronic circuit packaging module (12) includes a lower substrate, (16), an upper cooling unit (18) and a frame (12) disposed therebetween. The substrate (16) carries a plurality of integrated circuit chips (26) with lead-outs to a plurality of downwardly protruding dimpled contact points (50) disposed about the substrate periphery. The frame (12) includes a plurality of insulative inserts (14) about its periphery having conductive pins (34) each with a lower extension (38) extending below the insert and an upper contact point (36) recessed within the insert. The cooling unit (18) includes a plurality of fluid bags (22) each in contact with a respective chip (26) on the substrate (16) for thermal management. A plurality of such modules (10) are stacked in vertical registry whereby each downwardly protruding dimple (50) of a module (10) extends into a respective insert recess (36) of an adjacent module (10) therebelow. Electrical contactis thus effected between the respective dimples (50) on the lower surface of the upper module (10) and respective upper contact points of the recessed pins (36) on the upper surface of the cover module. (10).