公开(公告)号：US3763551A

公开(公告)日：1973-10-09

申请号：US3763551D

申请日：1972-06-12

Applicant: IBM

Inventor： HERRON C

IPC: H02K23/26 ,  H02K3/26 ,  H02K15/04 ,  H02K23/58 ,  H02K15/02 ,  H02K15/10

CPC classification number: H02K3/26 ,  Y10T29/49012

Abstract: Tubular high torque - low inertia printed circuit armatures are manufactured from two flexible circuit cards. Each card is comprised of a layer of conductive metal laminated to a layer of insulation. The layer of insulation is patterned to expose a pair of spaced parallel bands of metal, on the insulation side of each card. These spaced bands form the circuit interconnecting tabs of the metal winding conductors which extend into the spaced bands. The abutting surfaces of the two cards are coated with an adhesive which will bond the cards together under a heat and pressure environment. The cards are loosely rolled about a low or zero temperature coefficient mandrel, with the interconnecting tabs of one card in registry with the interconnecting tabs of the other card, and with the cards axially overlapping one another at the sides which form the axial seam of the tubular armature. The diameter of the mandrel accurately establishes the inner diameter of the finished armature. The mandrel and encircling cards are placed in an inflatable oven. This oven is formed by a rubber sleeve or tube which carries an integral heater and a temperature sensor. The oven is pressurized to thereby force the two cards down onto the mandrel. The heater is energized and a servocontrolled temperature is maintained for a given time period. The resulting tube is removed from the mandrel, and the tabs are electrically connected to form the armature winding.

Abstract translation: 管状高扭矩 - 低惯量印刷电路电枢由两个柔性电路卡制造。 每个卡由层压到绝缘层的导电金属层组成。 绝缘层被图案化以在每个卡的绝缘侧上露出一对隔开的金属平行带。 这些间隔的带形成延伸到间隔的带中的金属绕组导体的互连接片的电路。 两个卡片的邻接表面涂有粘合剂，粘合剂将在热和压力环境下将卡片粘合在一起。 卡片围绕低或零温度系数心轴松散地卷绕，其中一个卡的互连突片与另一卡的互连突片对准，并且卡片在侧面彼此轴向重叠，形成轴向接缝 管状电枢。 心轴的直径准确地确定了成品电枢的内径。 心轴和环绕的卡片放置在充气烤箱中。 该烤箱由带有一体式加热器和温度传感器的橡胶套筒或管形成。 烤箱被加压，从而将两张卡片压在心轴上。 加热器通电并且在给定的时间段内维持伺服控制的温度。 所得到的管从心轴移除，并且突片被电连接以形成电枢绕组。

公开(公告)号：BR7601929A

公开(公告)日：1976-10-05

申请号：BR7601929

申请日：1976-03-30

Applicant: IBM

Inventor： HERRON C ,  WILLIAMS C

IPC: G11B5/41 ,  G11B15/67