Abstract:
A semiconductor structure includes at least one fuse, resistor, diffusion barrier or capacitor that is formed of refractory metal-silicon-nitrogen. A suitable refractory material is TaSiN which provides a wide range of resistivity by changing the ratio of Ta:Si:N.
Abstract:
Electronic structure that has in-situ formed resistors consists of a first plurality of conductive elements formed in an insulating material layer, a plurality of electrically resistive vias formed on top and in electrical communication with at least one of the first plurality of conductive elements, and a second plurality of conductive elements formed on top of and in electrical communication with at least one of the plurality of electrically resistive vias. The structure may further be formed in a multi-level configuration such that multi-level resistors may be connected in-series to provide larger resistance values. The structure may be combined with a capacitor network to form RC circuits.
Abstract:
PROBLEM TO BE SOLVED: To obtain a device, which has active devices formed on roughly continuous mesa regions, which are formed on more than one surfaces of an isolation region and consist of a semiconductor material, and conductive paths, which are formed on the mesa regions and are extended in the lengthwise directions of the mesa regions. SOLUTION: A semiconductor device has first active devices formed on mesa regions, which are formed by more than one sidewall of an isolation region 15 and consist of a semiconductor material, and conductive paths. The conductive paths are extended from the active devices to the lengthwise directions of the mesa regions. In one embodiment, a plurality of active devices are respectively formed on mesa region, and the active devices are connected electrically with each other through the mesa regions.
Abstract:
An electrically programmable fuse (eFuse) includes (1) a semiconducting layer above an insulating oxide layer of a substrate; (2) a diode formed in the semiconducting layer; and (3) a silicide layer formed on the diode. The diode comprises an N+,p-,P+ or P+,n-,N+ structure.
Abstract:
Hierarchical built-in self-test methods and arrangement for verifying system functionality. As a result, an effective built-in self-test methodology is provided for conducting complete system-on-chip testing, to ensure both the circuit reliability and performance of system-on-chip design. As an added advantage, development costs are reduced for system-on-chip applications.
Abstract:
A system and method for considerable reduction of power consumption in memory circuits implementing Vbb (array body bias) and Vwl (negative word line) voltage generators. The system comprises switching off the negative WL generator during sleep or standby mode, so that no power is consumed. A relaxed refresh operation is carried out and the negative WL is powered by the Vbb generator. The noise coupled to the negative WL supply from BL swing is reduced due to the joint Vbb-Vwl decoupling scheme. In the active mode, the Vbb and Vneg are separated to avoid any cross-over noise and to maintain design flexibility. During power-on period, the ramp-up rate of Vbb level is improved by the Vwl generator. The advantages may be summarized as: (1) simpler Vbb generator design, (2) much smaller Vbb generator size, (3) reduced Vbb power, (4) no stand-by current from Vwl generator, (5) low decoupling noise for Vwl level during stand-by or sleep mode, (6) enhanced ramp-up rate for Vbb during power-on, (7) no cross-over noise between Vbb and Vwl during active mode, and (8) design flexibility of Vbb and Vwl in the active mode. The principles and advantages of the invention may be applied to any two or more DC generator systems, negative or positive.
Abstract:
PROBLEM TO BE SOLVED: To provide a dielectric having a reduced dielectric constant, and to provide its manufacturing method. SOLUTION: In a first embodiment, a first method of manufacturing a dielectric having a reduced dielectric constant is provided. The first method includes the steps of: (1) forming a dielectric layer including a trench on a substrate; and (2) forming a cladding region in the dielectric layer by forming a plurality of air gaps in the dielectric layer along at least one of a sidewall and a bottom of the trench so as to reduce an effective dielectric constant of the dielectric. Numerous other aspects are provided. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a system for protecting a weak device operated in a micro-electronic circuit inclusive of a high voltage electric power supply from excess stress caused by a high voltage. SOLUTION: This system prevents a weak device from failing during an increase in output, during a decrease in output, and when a low voltage electric power supply is absent in a multiple electric power supply system. This system is provided with a circuit for detecting a low-voltage electric power supply configured to detect an increase in output of a circuit, a decrease in output of a circuit, and when a low-voltage electric power supply is absent and generate a control signal after the detection. This system further has a controllable current mirror device configured to supply a trickle current during an increase in output of a circuit, during a decrease in output of a circuit, and when a low-voltage electric power supply is absent, in response to a control signal received from the circuit for detecting a low-voltage electric power supply, to maintain a conductive channel of the weak device. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a phase change memory element connected to the edge part of a thin film electrode, and to provide a method of manufacturing the same. SOLUTION: A phase change memory (PCM) cell structure includes a first electrode 60E, a phase change element 70E, and a second electrode 80E, wherein the phase change element 70E is inserted between the first electrode 60E and the second electrode 80E, and only an edge part 75 of the first electrode 60E is contacted with the phase change element 70E, thereby reducing a contact area between the phase change element 70E and the first electrode 60E to increase a current density flowing through the phase change element 70E and effectively cause a phase change by a first programming power by a comparatively small current. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a device for monitoring hierarchical power source noise and a system for VLSI (very large scale integration) circuits. SOLUTION: In the system for monitoring hierarchical power source noise, the noise monitoring device is manufactured on-chip, and the noise on a chip is measured. In the noise-monitoring system, the plurality of on-chip noise-monitoring devices are distributed effectively in the chip. A noise analysis algorithm analyzes a noise characteristic, based on a collected noise data from the noise monitoring device, and the hierarchical noise monitoring system performs mapping operation to the system on the chip for the noise of each core. COPYRIGHT: (C)2004,JPO&NCIPI