公开(公告)号：MY113351A

公开(公告)日：2002-01-31

申请号：MYPI19950586

申请日：1995-03-09

Applicant: IBM

Inventor： JAMES CHRISTOPHER MAHLBACHER ,  JAMES EDWARD BOYETTE JR

IPC: G01R1/06 ,  G01R31/00 ,  G01R31/02 ,  G01R31/28 ,  H05K13/08

Abstract: A MECHANISM IS PROVIDED FOR TESTING CIRCUIT TRACES EXTENDING ALONG A FLEXIBLE SUBSTRATE (10). WHICH IS FED IN A LONGITUDINAL DIRECTION (15) BETWEEN AN UPPER PLATE (17) AND A LOWER PLATE (18). THE UPPER PLATE INCLUDES A NUMBER OF UPPER APERTURES (23) EXTENDING ACROSS THE FLEXIBLE SUBSTRATE AND A NUMBER OF UPPER SEGMENTS (20, 192). ALSO EXTENDING ACROSS THE FLEXIBLE SUBSTRATE BETWEEN ADJACENT APERTURES. THE LOWER PLATE INCLUDES LOWER SEGMENTS (22. 190) EXTENDING UNDER THE UPPER APERTURES AND LOWER APERTURES EXTENDING UNDER THE UPPER SEGMENTS. TWO UPPER TEST PROBES (24) ARE MOVED ABOVE THE FLEXIBLE SUBSTRATE. WHILE TWO LOWER TEST PROBES (26) ARE MOVED UNDER THE FLEXIBLE SUBSTRATE. TESTS ARE APPLIED TO BOTH SIDES OF THE FLEXIBLE SUBSTRATE AS THE PROBES ARE BROUGHT INTO CONTACT WITH TEST POINTS (188) IN THE AREAS ACCESSIBLE THROUGH THE UPPER AND LOWER APERTURES WITH SEGMENTS EXTENDING ALONG THE APERTURES ON THE OPPOSITE SIDES OF THE FLEXIBLE SUBSTRATE PROVIDING A BACKING SURFACE FOR PROBE CONTACT. A TWO-PROBE METHOD MAY BE USED TO DETERMINE THE ELECTRICAL CHARACTERISTICS OF A CIRCUIT TRACE EXTENDING BETWEEN TEST POINTS OR A SINGLE-PROBE METHOD MAY BE USED TO DETERMINE THE CAPACITANCE BETWEEN A CIRCUIT TRACE AND THE PLATES. CIRCUIT AREAS (150) ON THE SUBSTRATE ARE MOVED BETWEEN THE PLATES IN A SERIES OF INCREMENTAL MOTIONS TO EXPOSE VARIOUS POINTS THROUGH THE APERTURES AS REQUIRED TO COMPLETE THE TESTING PROCESS. ( FIGURE 1)

公开(公告)号：MY114147A

公开(公告)日：2002-08-30

申请号：MYPI19943560

申请日：1994-12-29

Applicant: IBM

Inventor： MICHAEL SERVEDIO ,  JIANN-CHANG LO ,  JAMES EDWARD BOYETTE JR

IPC: G01R31/02 ,  G01R1/06 ,  G01R31/28 ,  G01R1/073

Abstract: A SYSTEM FOR PROBING BOTH SIDES OF A HIGH DENSITY PRINTED CIRCUIT BOARD (92) INCLUDES AN OPEN FRAME (14) EXTENDING AROUND THE CIRCUIT BOARD WHEN IT IS HELD IN A TEST POSITION BY A CIRCUIT BOARD CARRIER (78). THE FRAME INCLUDES TWO PARALLEL RAIL STRUCTURES (20, 22) EXTENDING ABOVE, AND AT OPPOSITE ENDS OF, THE CIRCUIT BOARD IN THE TEST POSITION. THE FRAME ALSO INCLUDES ANOTHER TWO PARALLEL RAIL STRUCTURES EXTENDING BELOW, AND AT OPPOSITE ENDS OF, THE CIRCUIT BOARD. THE UPPER AND LOWER RAIL STRUCTURES EXTEND PERPENDICULARLY TO ONE ANOTHER, AND AREFASTENED TOGETHER AT THE CORNERS OF THE FRAME BY MEANS OF COMPRESSION BOLT ASSEMBLIES (48, 49). TWO GANTRY STRUCTURES (12) ARE MOVED IN A FIRST DIRECTION BETWEEN THE UPPER RAIL STRUCTURES, WHILE TWO OTHER GANTRY STRUCTURES ARE MOVED IN A DIRECTION PERPENDICULAR TO THE FIRST DIRECTION BETWEEN THE LOWER RAIL STRUCTURES. A CARRIAGE (36) MOVES ALONG EACH GANTRY STRUCTURE, AND A PROBE (56) IS MOUNTED ON EACH CARRIAGE TO BE MOVED TOWARD AND AWAY FROM THE ADJACENT SURFACE OF THE CIRCUIT BOARD. THE CIRCUIT BOARD IS MOVED BY A BOARD CARRIER BETWEEN A POSITION, OUTSIDE THE FRAME, IN WHICH IT IS LOADED AND UNLOADED, AND THE TEST POSITION.(FIG.1)