Real-time activity monitoring using thermal tags

    公开(公告)号:GB2570241B

    公开(公告)日:2019-11-27

    申请号:GB201906382

    申请日:2017-09-15

    Applicant: IBM

    Abstract: A thermal tag includes a power source to generate current along a resistive path and a plurality of infrared-emitting features positioned along the resistive path to emit infrared light along an infrared-emitting pattern, wherein the plurality of infrared-emitting features include one or more infrared-emitting stripes on a first surface of the thermal tag defining a pattern region and a plurality of infrared-emitting dots within a portion of the pattern region to provide a thermal-diffusion resistant pattern for activity monitoring.

    Thermal tags for real-time activity monitoring and methods for fabricating the same

    公开(公告)号:GB2570244A

    公开(公告)日:2019-07-17

    申请号:GB201906514

    申请日:2017-10-09

    Applicant: IBM

    Abstract: A thermal tag for activity monitoring. The thermal tag includes a base layer having a plurality of metal lines to provide a conductive path, and a pattern layer having one or more infrared emitting features positioned over portions of the conductive path, wherein at least one infrared emitting feature couples to the conductive path to emit a predetermined infrared pattern in accordance with nearby activity.

    Real-time activity monitoring using thermal tags

    公开(公告)号:GB2570241A

    公开(公告)日:2019-07-17

    申请号:GB201906382

    申请日:2017-09-15

    Applicant: IBM

    Abstract: A thermal tag includes a power source to generate current along a resistive path and a plurality of infrared-emitting features positioned along the resistive path to emit infrared light along an infrared-emitting pattern, wherein the plurality of infrared-emitting features include one or more infrared-emitting stripes on a first surface of the thermal tag defining a pattern region and a plurality of infrared-emitting dots within a portion of the pattern region to provide a thermal-diffusion resistant pattern for activity monitoring.

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