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公开(公告)号：JP2002057268A
公开(公告)日：2002-02-22
申请号：JP2000239963
申请日：2000-08-08
Applicant: IBM
Inventor： FUJIO SHOHEI , KABAYAMA HIDEKI
Abstract: PROBLEM TO BE SOLVED: To suppress EMI caused by a switching noise current induced in the power supply circuit of a QFP type IC10. SOLUTION: Leads including a power supply lead 12 and a ground lead 13 are connected with corresponding pads of a die 20 through a wiring board 16 in a package. A ground face 22 is provided in a mold 11 on the underside of the wiring board 16 in the package to spread along the bottom face of the mold 11 before being connected with the ground lead 13. A decouping capacitor 27 is connected with the power supply wiring of the wiring board 16 in the package and the ground face 22.
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