公开(公告)号：GB2605224B

公开(公告)日：2025-03-12

申请号：GB202115083

申请日：2021-10-21

Applicant: IBM

Inventor： KAMAL K SIKKA ,  SHIDONG LI ,  TUHIN SINHA ,  JEFFREY ALLEN ZITZ

IPC: H01L23/34

Abstract: A chip package comprises a chip having a first temperature sensor. The first temperature sensor is configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier coupled to the chip via a plurality of solder connections. The chip carrier includes a second temperature sensor vertically aligned with the first temperature sensor. The second temperature sensor is configured to measure a second temperature of the chip carrier in a localized area around the second temperature sensor. The chip carrier further includes a localized heater element located near the second temperature sensor and configured to generate heat in response to a detected difference based on comparison of the first temperature and the second temperature such that the detected difference is adjusted in the localized area around the first temperature sensor.

公开(公告)号：GB2605224A

公开(公告)日：2022-09-28

申请号：GB202115083

申请日：2021-10-21

Applicant: IBM

Inventor： KAMAL K SIKKA ,  SHIDONG LI ,  TUHIN SINHA ,  JEFFREY ALLEN ZITZ

IPC: H01L23/34

Abstract: A chip package 100 comprises a chip 102 having a first temperature sensor 108 configured to measure a first temperature of the chip in a localized area around the first temperature sensor. The chip package also includes a chip carrier 104 coupled to the chip via a plurality of solder connections 106. The chip carrier includes a second temperature sensor 112 vertically aligned with the first temperature sensor. The second temperature sensor is configured to measure a second temperature of the chip carrier in a localized area around the second temperature sensor. The chip carrier further includes a localized heater element 114 located near the second temperature sensor and configured to generate heat in response to a detected difference of the temperatures at the first and second temperature sensors.