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公开(公告)号:JP2000283526A
公开(公告)日:2000-10-13
申请号:JP8206699
申请日:1999-03-25
Applicant: IBM
Inventor: NAKANISHI TORU , TERADA HIROTO , KAWASE MOTOKAZU
Abstract: PROBLEM TO BE SOLVED: To keep uniform temperature inside a computer room by judging whether temperature obtained by simulation is within a specific temperature range or not, and by controlling at least one of wind directions of a fan for covering a position at a temperature that does not exist within the specific temperature range. SOLUTION: Based on temperature, the amount of the wind of a fan, and a wind direction, simulation is carried out, and temperature distribution is obtained. Under the control of a local PC 70, a circuit 76 for controlling the amount of wind controls the speed of a specified fan, and the amount of wind, namely, the force of wind. A circuit 78 for controlling an air conditioner controls the air conditioner according to the state of temperature. For example, when temperature inside a computer room is lower than a specific temperature range, the air conditioner is temporally stopped, or the air conditioner is operated by high power when cooling effect by the fan is low. A circuit 80 for controlling a stator position selectively drives the coil winding of the stator of the specified fan, and controls the wind direction of the fan under the control of the local PC 70.
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公开(公告)号:JP2000349481A
公开(公告)日:2000-12-15
申请号:JP11054599
申请日:1999-04-19
Applicant: IBM
Inventor: TERADA HIROTO , NAKANISHI TORU , KAWASE MOTOKAZU
IPC: H05K7/20 , G06F1/20 , H01L23/427 , H01L23/467
Abstract: PROBLEM TO BE SOLVED: To enable mounting of an MPU having high performance by improving cooling effect of a notebook personal computer. SOLUTION: A cooling device 11 for a computer is constituted by a housing 14 constituted differently from a notebook personal computer 12, a heat pipe 18 for absorbing heat generated in an MPU 16 which is a heat generating element in the personal computer 12 and for allowing the heat to move into the housing 14, and a heat dissipating means 20 for dissipating the heat moved into the housing 14 to the outside of the housing 14.
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