公开(公告)号：DE2242095A1

公开(公告)日：1973-05-10

申请号：DE2242095

申请日：1972-08-26

Applicant: IBM

Inventor： KINGTON BRIAN WILLIAM ,  VIGAR JAMES MICHAEL LINFORD

IPC: G11B5/02 ,  G11B5/245 ,  G11B5/31 ,  G11B5/49 ,  G11B15/12 ,  G11B5/22

公开(公告)号：GB1085862A

公开(公告)日：1967-10-04

申请号：GB179565

申请日：1965-01-15

Applicant: IBM

Inventor： KINGTON BRIAN WILLIAM

IPC: G01K7/00 ,  G01K7/16

Abstract: 1,085,862. Superconductive temperaturesensitive device. INTERNATIONAL BUSINESS MACHINES CORPORATION. Jan. 15, 1965, No. 1795/65. Heading H1K. A temperature-sensitive device comprises two contiguous layers of different electricallyconductive materials, at least one of the materials being capable of exhibiting superconductivity, the thickness of the layers not being uniform along the length of the device. A copper layer 2 is overlayed with a lead wedge 1, the copper layer being wider than the lead to prevent short-circuiting during resistance measuring. The layer 1 need not be wedge-shaped but may be stepped (Fig. 4, not shown), thus giving only two specific temperature values, alternatively the lower layer 2 may be wedge-shaped whilst the upper layer 1 is of constant thickness. If both layers 1 and 2 are super-conducting material, then they must have different critical temperatures.

公开(公告)号：DE2233453A1

公开(公告)日：1973-02-22

申请号：DE2233453

申请日：1972-07-07

Applicant: IBM

Inventor： HEARN BRIAN RICHARD ,  JONES ARTHUR SCOTT ,  KINGTON BRIAN WILLIAM ,  PATON ANDREW ,  VIGAR JAMES MICHAEL LINFORD ,  PASCUAL RAFAEL

IPC: G11B5/187 ,  G11B5/245 ,  G11B5/31 ,  G11B5/22