公开(公告)号：CA1182214A

公开(公告)日：1985-02-05

申请号：CA399132

申请日：1982-03-23

Applicant: IBM

Inventor： ARGUMEDO ARMANDO J ,  CHOW WILLIAM W ,  FREEMAN ROBERT D ,  KLECZKOWSKI SPAWOMIR P

IPC: G11B5/105 ,  G11B5/265 ,  G11B5/29 ,  G11B5/58

Abstract: THERMAL COMPENSATION FOR MAGNETIC HEAD ASSEMBLY Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stress fluctuation that occurs with temperature change. The clamping force of the leaf spring is precisely controlled.