公开(公告)号：JPS5763368A

公开(公告)日：1982-04-16

申请号：JP11239181

申请日：1981-07-20

Applicant: Ibm

Inventor： REO JIEEMUZU KADEUJIAN ,  HAABANSU SHINGU SAKUDEBU ,  KURINTON DEEBITSUDO SUNAIDAA

IPC: C09D11/00 ,  C09D11/02

CPC classification number: C09D11/328

公开(公告)号：JPS5763383A

公开(公告)日：1982-04-16

申请号：JP12830781

申请日：1981-08-18

Applicant: Ibm

Inventor： POORU RUISU JIENDORAA ,  BAABARA DEIAN GURANTO ,  KURINTON DEEBITSUDO SUNAIDAA

IPC: C09K9/02 ,  B41M5/20 ,  D21H19/10 ,  G02F1/15 ,  G02F1/153 ,  G02F1/17

CPC classification number: B41M5/20

公开(公告)号：JPS5479728A

公开(公告)日：1979-06-26

申请号：JP12694678

申请日：1978-10-17

Applicant: IBM

Inventor： JIENEBIIBU MAARII ADAMUSU ,  RICHIYAADO DEEBITSUDO BARANSON ,  KURINTON DEEBITSUDO SUNAIDAA

IPC: C09D11/16 ,  C09D11/00

公开(公告)号：JPH08255450A

公开(公告)日：1996-10-01

申请号：JP33742095

申请日：1995-12-25

Applicant: IBM

Inventor： ROBAATO II FUONTANA ,  JIEEMUZU DABURIYUU BAABARITSUK ,  MAIKERU ANSONII MOOJISU ,  AACHIBARUDO KIYURII MANSU JIYU ,  OSUKAA JIEI RUISU ,  KURINTON DEEBITSUDO SUNAIDAA

IPC: G11B3/10 ,  G11B5/127 ,  G11B5/31 ,  G11B5/48 ,  G11B5/54 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To obtain an, integrated assembly provided with a suspension arm and actuator arm. SOLUTION: At least one actuator coil 38 is arranged on an actuator arm and the coil 38 is fitted to at least one homogeneous supporting layer for supporting all layers and receives an actuator spindle. In addition, a hole 40 which pass through all layers of an actuator section is formed at a pivot point. A converter coil layer can be arranged in a common plane with the actuator coil layer by integrating the coil layer with a suspension section. The actuator section is provided with a silicon substrate 120 incorporated with integrated processing circuits 54/56 connected to the converter coil layer and a device can be supported with an assemble so that the suspension section can be bent against the actuator arm section. A plurality of integrated assemblies of a horizontal recording magnetic head 32 having a high-accuracy magnetic gap is manufactured nearly completely at a wafer level.