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Patent Agency Ranking
公开(公告)号：US3702042A
公开(公告)日：1972-11-07
申请号：US3702042D
申请日：1970-11-25
Applicant: IBM
Inventor： COCHRAN THOMAS J , COUGHLIN CHARLES P , FICKER WALTER W , LENT CHARLES V , SULLIVAN JOSEPH M
IPC: H01C17/245 , B24C3/04
CPC classification number: H01C17/245
Abstract: This patent discloses apparatus for altering the electrical characteristics of electrical and electronic components by trimming or abrading, the rate of abrading being variable and is responsive to changes in the electrical characteristics of the components during the abrading operation. Electrical components that have electrical characteristics that may be altered by the abrading apparatus include resistors, capacitors, inductors, semiconductive devices, and photocells. The apparatus includes electrical circuitry for both accurate control of the rate of abrasion and enabling production of electrical and electronic components to predetermined characteristics with unusually close manufacturing tolerances. The circuitry includes a highly sensitive Kelvin bridge at each abrading station, the circuitry being programmable for trim pretesting, control of the rate of abrading, and post-testing. The circuitry may also be programmed to abrade a discrete component to predetermined tolerances, and/or abrade one of a pair of components to a predetermined ratio of the electrical characteristic of one component to the electrical characteristic of the other of the pair. Additionally, the circuitry may be programmed to abrade one component in a connected closed loop of components to predetermined tolerances, for example ''''in circuit'''' abrading. The mechanical arrangement of the apparatus provides for sequentially abrading multiple electrical and electronic components which may be positioned on both the upper and lower surfaces of single insulating members such as ceramic substrates. The apparatus is fully mechanized for rapid processing of a high production product through sequential abrading stations and includes stations for rejecting out-of-tolerance components.
Abstract translation: 该专利公开了通过修整或研磨来改变电气和电子部件的电气特性的装置，其研磨速率是可变的并且响应于在研磨操作期间部件的电特性的变化。 具有可由研磨装置改变的电特性的电气部件包括电阻器，电容器，电感器，半导体器件和光电池。
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公开(公告)号：IT1165431B
公开(公告)日：1987-04-22
申请号：IT2812779
申请日：1979-12-18
Applicant: IBM
Inventor： HAAS ROBERT G , LENT CHARLES V
Abstract: In a high density solenoid operated multiple punch apparatus, having a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side, solenoid elements mounted in the large bores, a plurality of holes with a diameter smaller than the large bores aligned with the large bores and extending the remaining distance through the punch head to the bottom side, push rod elements slidably disposed in the holes actuated by the solenoid elements, the improvement being A cooling system for the punch head which includes a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores, a plurality of elongated grooves in the bottom surface of the head located between rows of the plurality of holes and forming a recessed chamber connecting a row of the small bores, a plate seated in each of the elongated grooves with each plate separating the associated groove into a first manifold chamber located between the plate and the bottom of the groove and a second manifold chamber on the opposite side of the plate, tubes disposed in and extending through each of the plates with each tube concentrically located in one of the small bores, and openings to introduce liquid in one of the manifold chambers and remove liquid from the other manifold chamber.
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公开(公告)号：DE2964862D1
公开(公告)日：1983-03-24
申请号：DE2964862
申请日：1979-11-27
Applicant: IBM
Inventor： HAAS ROBERT G , LENT CHARLES V
Abstract: In a high density solenoid operated multiple punch apparatus, having a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side, solenoid elements mounted in the large bores, a plurality of holes with a diameter smaller than the large bores aligned with the large bores and extending the remaining distance through the punch head to the bottom side, push rod elements slidably disposed in the holes actuated by the solenoid elements, the improvement being A cooling system for the punch head which includes a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores, a plurality of elongated grooves in the bottom surface of the head located between rows of the plurality of holes and forming a recessed chamber connecting a row of the small bores, a plate seated in each of the elongated grooves with each plate separating the associated groove into a first manifold chamber located between the plate and the bottom of the groove and a second manifold chamber on the opposite side of the plate, tubes disposed in and extending through each of the plates with each tube concentrically located in one of the small bores, and openings to introduce liquid in one of the manifold chambers and remove liquid from the other manifold chamber.
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公开(公告)号：CA1107152A
公开(公告)日：1981-08-18
申请号：CA338176
申请日：1979-10-23
Applicant: IBM
Inventor： HAAS ROBERT G , LENT CHARLES V
Abstract: A high density solenoid operated multiple punch apparatus to which the invention relates includes a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side. Solenoid elements are mounded in the large bores. A plurality of holes with a diameter smaller than the large bores are aligned with the large bores and extend the remaining distance through the punch head to the bottom side. Push rod elements are slidably disposed in the holes and are actuated by the solenoid elements. The improvement according to the invention includes a cooling system for the punch head which has a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores. A plurality of elongated grooves in the bottom surface of the head are located between rows of the plurality of holes and form a recessed chamber connecting a row of the small bores. A plate is seated in each of the elongated grooves with each plate separating the associated groove into a first manifold chamber located between the plate and the bottom of the groove and a second manifold chamber on the opposite side of the plate. Tubes are disposed in and extend through each of the plates with each tube concentrically located in one of the small bores. Openings are provided to introduce liquid in one of the manifold chambers and remove liquid from the other manifold chamber.
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公开(公告)号：IT7928127D0
公开(公告)日：1979-12-18
申请号：IT2812779
申请日：1979-12-18
Applicant: IBM
Inventor： HAAS ROBERT G , LENT CHARLES V
Abstract: In a high density solenoid operated multiple punch apparatus, having a punch head provided with the plurality of closely-spaced large bores arranged in column and rows that extend partially through the punch head from the top side, solenoid elements mounted in the large bores, a plurality of holes with a diameter smaller than the large bores aligned with the large bores and extending the remaining distance through the punch head to the bottom side, push rod elements slidably disposed in the holes actuated by the solenoid elements, the improvement being A cooling system for the punch head which includes a plurality of small bores arranged in rows in the bottom of the punch head terminating short of the top surface and positioned in the area between the plurality of large bores, a plurality of elongated grooves in the bottom surface of the head located between rows of the plurality of holes and forming a recessed chamber connecting a row of the small bores, a plate seated in each of the elongated grooves with each plate separating the associated groove into a first manifold chamber located between the plate and the bottom of the groove and a second manifold chamber on the opposite side of the plate, tubes disposed in and extending through each of the plates with each tube concentrically located in one of the small bores, and openings to introduce liquid in one of the manifold chambers and remove liquid from the other manifold chamber.
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