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    Thermocompression bonding apparatus
    2.
    发明授权
    Thermocompression bonding apparatus 失效
    热电偶连接装置

    公开(公告)号：US3580460A

    公开(公告)日：1971-05-25

    申请号：US3580460D

    申请日：1968-07-26

    Applicant: IBM

    Inventor： LIPSCHUTZ LEWIS D

    IPC: B23K20/02 ,  H01L21/00 ,  B23K1/00 ,  B23K37/04

    CPC classification number: H01L21/67138 ,  B23K20/023 ,  Y10S228/904

    Abstract: A thermocompression bonding apparatus having a plurality of slidably disposed, independently operable impact surfaces. A plurality of pistons are slidably disposed in a housing, and each include extension means terminating in respective impact surfaces. The pistons are actuated so as to urge the impact surfaces into an impact zone so as to affect a plurality of thermocompression bonds.

    ELECTRONIC PACKAGE
    5.
    发明专利
    ELECTRONIC PACKAGE 未知

    公开(公告)号：DE3277756D1

    公开(公告)日：1988-01-07

    申请号：DE3277756

    申请日：1982-03-01

    Applicant: IBM

    Inventor： LIPSCHUTZ LEWIS D ,  MEAGHER RALPH ERNST ,  PRESTI FRANK PATRICK

    IPC: H05K7/20 ,  H01L23/34 ,  H01L23/36 ,  H01L23/433 ,  H01L23/42

    Abstract: A cooling system for an electronic package has a support substrate (12) with at least one electronic device (20) and a cover (14) in spaced proximity to the device. A thermal bridge for conducting heat from the device to the cover includes a relatively thick (24) metal sheet provided with cuts that define at least one tab element (34, 35) with grooves (30, 32) that make it bendable. Spring means (26) selectively urge the tab element into contact with the device.

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