METHOD FOR SELECTIVE ELECTROPLATING

    公开(公告)号:DE3376023D1

    公开(公告)日:1988-04-21

    申请号:DE3376023

    申请日:1983-11-08

    Applicant: IBM

    Abstract: A low conductivity fluid mask in a predetermined fluid state is used as a mask in an electroplating jet system. Preferred is a deionized water mask. A first nozzle (18) applies to the workpiece (W) to be electroplated a masking fluid layer (29) covering selected regions or the complete workpiece. A second nozzle (1) applies the electroplating solution to the desired workpiece regions (M). If the complete workpiece was covered, the second jet pierces the masking layer (29) to plate the underlying exposed portions of said surface.

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