公开(公告)号：FR2301077A1

公开(公告)日：1976-09-10

申请号：FR7600768

申请日：1976-01-08

Applicant: IBM

Inventor： ANDERSON RONALD L ,  CASTELLANI EUGENE E ,  MCCAFFREY PATRICK M ,  ROMANKIW LUBOMYR T

IPC: H01F1/147 ,  C21D6/00 ,  C22F1/10 ,  H01F1/14 ,  H01F10/00 ,  H01F10/14 ,  H01F41/14 ,  H01F1/00 ,  G11B5/00

公开(公告)号：FR2354633A1

公开(公告)日：1978-01-06

申请号：FR7714017

申请日：1977-05-03

Applicant: IBM

Inventor： ANDERSON RONALD L ,  CASTELLANI EUGENE E ,  MCCAFFREY PATRICK M ,  ROMANKIW LUBOMYR T

IPC: H05K3/18 ,  C25D5/02 ,  H01L21/768 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H01L21/441

Abstract: A metal pattern is made by selective electroplating on an underlay. A substrate is coated with a layer (I) providing adhesion, and then an underlay (II) followed by a thin, non-platable layer (III) onto which a mask is applied, forming a negative pattern. The exposed zone (IV) of layer (III) are removed; and the exposed zones of the underlay (II) are electroplated; then, and as required, the mask the remainder of layer (III), the bare underlay (II), and opt. layer (I), can be removed. Underlay (II) is pref. metal, esp. Cr, Ti, Ta, Nb, or Hf, whereas layer (III) is dielectric, esp. SiO2, Si3N4, Al2O3, SiO, an organo-silicate, or a polymer. Zones (IV) are pref. removed by plasma etching in at atmos. of C2Cl3F3 or C2Cl3F3 plus O2. The electroplated pattern is pref. Au, Cu, Ni, Ni-Fe, Pt, Pd, or their alloys with other metals; a lacquer mask is pref. used, whereas layer (I) is Cr, Ti, Ta, Nb, Al, Hf, or similar metals, and 100-1000 A thick. Underlay (II) is pref. 100-2000 A thick, and layer (III) 450 A thick. Method is used for providing metal patterns on microelectronic components; magnetic cylinder domin- or magnetic- components. Gold patterns for example, can be obtd. which do not lift off at their edges.