公开(公告)号：US3228811A

公开(公告)日：1966-01-11

申请号：US6706160

申请日：1960-11-03

Applicant: IBM

Inventor： MCGIBBON RALPH C

IPC: H01L21/00 ,  H01L21/18 ,  H01L29/00

CPC classification number: H01L21/00 ,  H01L21/185 ,  H01L29/00 ,  Y10S438/979

公开(公告)号：US3614550A

公开(公告)日：1971-10-19

申请号：US3614550D

申请日：1969-01-09

Applicant: IBM

Inventor： MARINACE JOHN C ,  MCGIBBON RALPH C

IPC: H01S5/30 ,  H01L15/00

CPC classification number: H01S5/30

Abstract: An improved electromagnetic wave-emitting device is provided. A high pressure is applied to the device by potting the device in a suitable encapsulant. The potted device exhibits a decreased threshold current density and an increase in its efficiency. Additionally, the device has a more durable structure and an increased shelf life.

公开(公告)号：CA1184321A

公开(公告)日：1985-03-19

申请号：CA399153

申请日：1982-03-23

Applicant: IBM

Inventor： MARINACE JOHN C ,  MCGIBBON RALPH C

IPC: G03F7/09 ,  G03F7/11 ,  H01L21/312 ,  G03F7/02

Abstract: A process for improving the adhesion of a photoresist to a substrate by applying a layer of titanium, zirconium, hafnium and/or oxide thereof between the photoresist and substrate.