公开(公告)号：JPS61177738A

公开(公告)日：1986-08-09

申请号：JP20460485

申请日：1985-09-18

Applicant: IBM

Inventor： BECKMAN KEITH FOWLER ,  KOLMAN ANNE ELIZABETH ,  MCGUIRE KATHLEEN MARY ,  PUTTLITZ KARL JOSEPH ,  QUINONES HORATIO

IPC: H01L21/60 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34

公开(公告)号：DE3675554D1

公开(公告)日：1990-12-20

申请号：DE3675554

申请日：1986-01-17

Applicant: IBM

Inventor： BECKHAM KEITH FOWLER ,  KOLMAN ANNE ELIZABETH ,  MCGUIRE KATHLEEN MARY ,  PUTTLITZ KARL JOSEPH ,  QUINONES HORATIO

IPC: H01L21/60 ,  H01L21/56 ,  H05K3/28 ,  H05K3/34

Abstract: An improved solder interconnection for forming 1/0 connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.