公开(公告)号：DE3266912D1

公开(公告)日：1985-11-21

申请号：DE3266912

申请日：1982-06-15

Applicant: IBM

Inventor： FLEMING REBECCA POWERS ,  LAWNHORNE JR ,  MELE JOHN JOSEPH ,  PRASAD CHANDRIKA

IPC: C23C18/34 ,  C23C10/28 ,  C23C18/16 ,  H01L21/288 ,  H05K3/38 ,  C23C18/32 ,  C03C17/10

Abstract: A method of providing a stress-free metal layer by electroless plating techniques, including the steps of (1) providing a substrate that includes some glass material in at least the surface areas to receive a metal layer, (2) depositing a layer of metal-boron by electroless plating techniques, and (3) heating the resultant metal-boron layer in a non-reacting and/or H2 environment at a temperature of at least 750 DEG C. for a time sufficient to diffuse the boron to the glass material in the substrate.