公开(公告)号：JPH1064929A

公开(公告)日：1998-03-06

申请号：JP16762597

申请日：1997-06-24

Applicant: IBM

Inventor： MICHAEL BERGER ,  MARK S CHACE ,  SACHDEV KRISHNA GANDHI

IPC: C08G59/30 ,  C08G59/62 ,  C09J163/00 ,  H01L21/52 ,  H01L21/58

Abstract: PROBLEM TO BE SOLVED: To endure the condition of exposure to the stress used for product reliability test, with no problem of resin bleeding, and to allow re-working without damaging a device and package material, by employing a resin composition containing a siloxane-contained polyepoxide, a curing additive soluble in it and a curing medium. SOLUTION: A composition which is curable with no solvent is employed which contains a siloxane-containing polyepoxide, curing additive which is soluble in it without a medium, and a curing medium. As the polyepoxide, the one expressed by a general equation, with x being 2-8, n being 1-10 is preferable. For example, a mixture of 1.3-bis(glycidoxypropyl) tetramethyldisiloxane 3.66g and 2,2',4,4'-tetrahydroxybenzophenon 1.2g is heated while agitated at 50-60 deg.C to generate a transparent solution. Then, the solution is cooled down to a room temperature, and mixed with di-n-butyl-dilauphosphate-tin 0.1g and liquid-like dicyanate aryl 0.2g, and then a silver flake 14.5g is added, to obtain a homogeneous disperse system.