公开(公告)号：US3914000A

公开(公告)日：1975-10-21

申请号：US35167273

申请日：1973-04-16

Applicant: IBM

Inventor： BECKERMAN MARTIN ,  MURPHY JOHN A ,  ORLANDI JOHN V ,  SMITH GEORGE W

IPC: H01J9/40 ,  H01J9/26 ,  H01J9/38

CPC classification number: H01J9/261

Abstract: During the course of fabricating a gas panel, a partially completed gas panel is placed in a vacuum oven for a bake-out, back fill and sealing operation. During the bake-out, the oven is evacuated to remove gaseous and vapors contaminants from the gas panel. Thereafter, during the back fill operation, a display gas atmosphere is admitted to the oven which fills the gas panel. Thereafter, the panel is sealed to lock in the desired display gas. The sealing is accomplished by providing a hole in the back panel in which is placed a plug so shaped as to allow the gas panel to be initially evacuated and thereafter back filled with gas. Once the panel is back filled, the plug is selectively melted to fill the hole and then allowed to solidify to complete the seal.

Abstract translation: 在制造气体面板的过程中，将部分完成的气体面板放置在真空烘箱中以进行烘烤，回填和密封操作。 在烘烤期间，将炉子抽真空以从气体面板中除去气体和蒸气污染物。 此后，在后填充操作期间，将显示气体气体进入到填充气体面板的烘箱中。 此后，面板被密封以锁定所需的显示气体。 密封是通过在后面板中设置一个孔来实现的，在该孔中放置一个如此成形的塞子，以允许气体板最初被抽空，然后再填充气体。 一旦面板被填充后，插头被选择性地熔化以填充孔，然后使其固化以完成密封。