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公开(公告)号:CA1044367A
公开(公告)日:1978-12-12
申请号:CA221753
申请日:1975-03-10
Applicant: IBM
Inventor: NELSON GEORGE N , TALKE FRANK E , TSENG RAYMOND C
Abstract: ROTARY HEAD ASSEMBLY FORMING AIR BEARING WITH TAPE In a helical drive tape apparatus, a rotary head drum is disposed between two sections of a split cylindrical mandrel about which a magnetic tape is guided. The head drum supports at least one magnetic transducer at its periphery, so that the total diameter of the head drum and projecting transducer is greater than the diameter of the adjacent mandrel sections. The projecting transducer has a spherical contoured portion and is configured at its leading edge, relative to the moving tape, to form an air bearing between the head and the tape. The spherical contoured portion and configured leading edge both project beyond the outer surface of the mandrel relative to the tape.
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公开(公告)号:CA1310227C
公开(公告)日:1992-11-17
申请号:CA564156
申请日:1988-04-14
Applicant: IBM
Inventor: ELDRIDGE JEROME M , KELLER GARY S , LEE FRANCIS C , NELSON GEORGE N , OLIVE GRAHAM
Abstract: THERMAL DROP-ON-DEMAND INK JET PRINT HEAD A thermal drop-on-demand ink jet print head in which an array of heating means is provided on one surface of a substrate member. A common electrode provides electrical contact to the heating means, and an array of data electrodes provides electrical contact to individual ones of the heating means. An array of feed through conductors is provided which pass through to the opposite surface of the substrate member to provide electrical contact between one of the data electrodes and one of an array of conductors leading to spaced solder pads on the opposite surface of the substrate member. A nozzle plate is mounted adjacent to the substrate member with a nozzle adjacent to each of the heating means so that, upon connection of an electrical signal to one of the solder pads, the corresponding heating means is energized and a drop of ink is ejected from the adjacent nozzle. Various embodiments are described in which multiplexing techniques are used to achieve a reduction in electrical connections and electronic drivers.
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