公开(公告)号：US3912668A

公开(公告)日：1975-10-14

申请号：US47997574

申请日：1974-06-17

Applicant: IBM

Inventor： NEUMANN EDWARD W ,  RAHEMBA FRANCIS J ,  SCHEINBERG STANLEY

IPC: C09D5/24 ,  C23F5/02

CPC classification number: C09D5/24

Abstract: One or more metallic carbides having the general structure MC in which M is selected from the group consisting of Titanium (Ti), Zirconium (Zr), Niobium (Nb), Hafnium (HF), Tantalum (Ta) and Tungsten (W) are mixed with standard paints to produce a paint which will provide a coating that has a very low electrical impedance in a direction orthogonal to the plane of the coating.

Abstract translation: 一种或多种具有一般结构MC的金属碳化物，其中M选自钛（Ti），锆（Zr），铌（Nb），铪（HF），钽（Ta）和钨（W） 与标准涂料混合以产生涂料，其将在与涂层平面垂直的方向上提供具有非常低的电阻抗的涂层。

公开(公告)号：US3898360A

公开(公告)日：1975-08-05

申请号：US43811374

申请日：1974-01-30

Applicant: IBM

Inventor： NEUMANN EDWARD W ,  THOMAS WILLIAM C

IPC: B41F31/24 ,  B30B15/06

CPC classification number: B41F31/24 ,  Y10S428/909 ,  Y10T428/249961 ,  Y10T428/249979 ,  Y10T428/249989 ,  Y10T428/266 ,  Y10T442/3894 ,  Y10T442/3919

Abstract: An inking platen suitable for use with impact printers and comprising a unitary microporous nylon body having a thin microporous flexible tough outer skin portion, and a ribbon affixed to the skin; the ribbon being woven of nylon fibers, the body being compression molded from a predetermined particulate nylon blend of a minority of high mesh nylon and the remainder of low mesh nylon.

Abstract translation: 适合与冲击式打印机一起使用的上墨台板，包括具有薄的微孔柔性韧性外皮部分的单一微孔尼龙体和贴在皮肤上的色带; 该丝带由尼龙纤维编织而成，该主体由少量高网状尼龙和剩余的低网状尼龙的预定颗粒尼龙混合物压缩成型。

公开(公告)号：FR2307441A1

公开(公告)日：1976-11-05

申请号：FR7603007

申请日：1976-01-29

Applicant: IBM

Inventor： NEUMANN EDWARD W ,  RABENDA EDWARD J JR

IPC: H05K3/28 ,  H05K7/20

Abstract: A thermally conducting cushion-like elastomeric pad of RTV (Room Temperature Vulcanized) silicone rubber moled with indentations in one surface to fit in glove-like relationship with electronic components situated on a component carrying card, the opposite surface mounted flush with a heat sink such that the heat generated by the electronic components is transferred through the pad to the heat sink.