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    SOLDER WITH LOW MELTING POINT
    1.
    发明专利
    SOLDER WITH LOW MELTING POINT 失效

    公开(公告)号：JPH0318497A

    公开(公告)日：1991-01-28

    申请号：JP14016690

    申请日：1990-05-31

    Applicant: IBM

    Inventor： NIEDRICH DANIEL SCOTT

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    Abstract: PURPOSE: To decrease the amt. of the copper to be fused into low melting temp. solder contg. tin and copper and to prevent the deterioration of solderability by selecting the amt. of the copper in this solder so as to attain a binary tin- copper eutectic point compsn. or below. CONSTITUTION: The compsn. of the solder doped with the copper of the atm. which is the amt. to provide the binary tin-copper eutectic point compsn. or below but is not zero is formed. The solder of such compsn. is capable of drastically decreasing the amt. of the copper melted from the wall surfaces of through-holes into the copper-doped solder at the time of assembly and correction. Even more, the deterioration of the solderability is averted and there is no need for increasing the soldering temp. As a result, the peeling of the finished products of multilayered circuit boards and the deterioration relating to other temp. are averted and the effects described above may be obtd. within the tin solder contg. the copper capable of executing soldering at the low temp. at which a good fatigue characteristic may be rendered.

    3.
    发明专利
    未知

    公开(公告)号：ES2069622T3

    公开(公告)日：1995-05-16

    申请号：ES90108688

    申请日：1990-05-09

    Applicant: IBM

    Inventor： NIEDRICH DANIEL SCOTT

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

    4.
    发明专利
    未知

    公开(公告)号：BR9002559A

    公开(公告)日：1991-08-13

    申请号：BR9002559

    申请日：1990-05-30

    Applicant: IBM

    Inventor： NIEDRICH DANIEL SCOTT

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

    9.
    发明专利
    未知

    公开(公告)号：DE69017516T2

    公开(公告)日：1995-10-05

    申请号：DE69017516

    申请日：1990-05-09

    Applicant: IBM

    Inventor： NIEDRICH DANIEL SCOTT

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

    10.
    发明专利
    未知

    公开(公告)号：DE69017516D1

    公开(公告)日：1995-04-13

    申请号：DE69017516

    申请日：1990-05-09

    Applicant: IBM

    Inventor： NIEDRICH DANIEL SCOTT

    IPC: B23K35/26 ,  C22C13/00 ,  H05K3/34

    Abstract: Low melting temperature copper-containing solders are disclosed for soldering and rework on copper surfaces. The amount of copper required in the solder in order to inhibit dissolution of the copper surface to be soldered has been found to be dopant level, below the binary tin-copper eutectic point.

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