公开(公告)号：CA2036959A1

公开(公告)日：1993-06-29

申请号：CA2036959

申请日：1991-02-25

Applicant: IBM

Inventor： ARVANITAKIS NICOLAOS C ,  BLACK VINCENT J ,  CORLEY RICHARD E JR ,  NOLAN RICHARD G ,  OLSON LEONARD T JR

IPC: G02B6/42 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/12 ,  H01L33/00 ,  H01S5/00

Abstract: An optoelectronic assembly (10) for providing bidirectional data transmission between fiber optic means (11) and an electrical circuit member (13). The assembly includes a two-part housing (17) with first and second receptacle sections (23, 25) designed for accommodating a pair of optoelectronic devices (31, 33). One of these devices serves as a receiver and the other a transmitter. These devices are aligned within the housing and electrically connected to a substrate member (27) also positioned within the housing. The substrate provides the necessary electrical functioning and is in turn electrically connected via conductor pins (69) to the described circuit member, this connection occurring through an opening within the bottom portion of the two-part housing. The assembly is designed for coupling with individual optical fiber members or, alternatively, with a common duplex connector having optical fibers therein.

公开(公告)号：CA2036959C

公开(公告)日：1993-06-29

申请号：CA2036959

申请日：1991-02-25

Applicant: IBM

Inventor： ARVANITAKIS NICOLAOS C ,  BLACK VINCENT J ,  CORLEY RICHARD E JR ,  NOLAN RICHARD G ,  OLSON LEONARD T JR

IPC: G02B6/42 ,  H01L31/02 ,  H01L31/0232 ,  H01L31/12 ,  H01L33/00 ,  H01S5/00

Abstract: An optoelectronic assembly for providing bidirectional data transmission between fiber optic means (e.g., a pair of optical fibers) and an electrical circuit member (e.g., a printed circuit board). The assembly includes a two-part housing with first and second receptacle sections designed for accommodating a pair of optoelectronic devices. One of these devices serves as a receiver and the other a transmitter. These devices are aligned within the housing and electrically connected to a substrate member (e.g., ceramic) also positioned within the housing. The substrate provides the necessary electrical functioning and is in turn electrically connected (e.g., via conductor pins) to the described circuit member, this connection occurring through an opening within the bottom portion of the two-part housing. The assembly is designed for coupling with individual optical fiber members or, alternatively, with a common duplex connector having optical fibers therein.