Abstract:
PROBLEM TO BE SOLVED: To provide a method and system for controlling temperature of a high power device by using zero input leakage current.SOLUTION: A heat control and temperature monitoring system (HCTMS) utilizes a temperature sensor to sense the junction temperature of a component, which becomes self-heated due to the zero input leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this zero input self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then initialized by applying full system power and triggering a defined initialization sequence/procedure. Once the component is operational, the component's temperature is maintained above the minimum operating threshold via continued self-heating, continued augmentation of the applied DC voltage, or both, as is required.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and system for efficiently extending the operating temperature range of high power components within a system/device.SOLUTION: An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, temperature control logic initiates pre-heating to raise the temperature of the component to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source. If self heating is unable to maintain the operational temperature, the heating source is utilized to assist in maintaining the operational temperature of the component, and thereby extends the useable operational temperature range of the system in which the components are employed.
Abstract:
PROBLEM TO BE SOLVED: To provide a system and method for controlling temperature of a high power device. SOLUTION: By a heat control and temperature monitoring system (HCTMS), a jointing temperature of components is monitored using a temperature sensor (403), and an applied power is increased so that a self heating characteristics is enhanced by a zero input leakage current specific to the component (404). Preheating of a device is accelerated so that attaining of the component to a functional temperature range is accelerated (410). The system then applies an overall system power to execute an initializing sequence (411). Even after the component comes into an operation state, the temperature of the component is kept at the operation temperature range higher than the lowest operation threshold by continuous self heating, continuous increase of applied DC voltage, or by both of them as required (412). COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and system for efficiently extending the operation temperature range of high power components within a system/device. SOLUTION: An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, a temperature control logic initiates pre-heating to raise the component's temperature to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source. If self heating is unable to maintain the operational temperature, the heating source is utilized to assist in maintaining the component's operational temperature, and thereby extends the useable operational temperature range of the system in which the components are employed. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
Direct communication between a primary portable unit initiating the communic ation and a secondary portable unit is establishecl utilizing two handshaking operations . The first handshaking operation is performed in the base station channel to establish initial contact between the primary and secondary portable units. After initial contact is m ade, the second handshaking operation is performed to establish communication in an unoccupi ed channel. The base station channel and the unoccupied channel may be a TDMA/TDD channe l or a TDMA/FDD channel.
Abstract:
Direct communication between a primary portable unit initiating the communic ation and a secondary portable unit is establishecl utilizing two handshaking operations . The first handshaking operation is performed in the base station channel to establish initial contact between the primary and secondary portable units. After initial contact is m ade, the second handshaking operation is performed to establish communication in an unoccupi ed channel. The base station channel and the unoccupied channel may be a TDMA/TDD channe l or a TDMA/FDD channel.