公开(公告)号：CA1241452A

公开(公告)日：1988-08-30

申请号：CA509371

申请日：1986-05-16

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  ELMGREN PETER J ,  OWEN CHARLES J ,  SISSENSTEIN DAVID W JR ,  YEH HELEN L

IPC: B23K1/00 ,  B23K1/008 ,  B23K35/36 ,  B23K35/38 ,  B23K101/42 ,  H05K3/34

Abstract: REDUCTION ATMOSPHERE WORKPIECE JOINING A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.