Emc gasket filler, and emc shielding method
    1.
    发明专利
    Emc gasket filler, and emc shielding method 有权
    EMC垫片填料和EMC屏蔽方法

    公开(公告)号:JP2009088493A

    公开(公告)日:2009-04-23

    申请号:JP2008227154

    申请日:2008-09-04

    CPC classification number: H05K9/0016

    Abstract: PROBLEM TO BE SOLVED: To provide an improved EMC gasket filler for shielding an empty slot of an electric enclosure in a computing system environment. SOLUTION: An electromagnetic gasket filler 20 includes: a first conductive shell 30 having a pair of first side walls 36 and a pair of first end walls 40 extending from a first bottom wall 42 defining a first aperture where at least one first external bias is placed on each of a pair of the first side walls and a first tab is extended from each of a pair of the first end walls, wherein the first bottom wall has a first aperture array and a pair of apertures; and a second conductive shell 60 having a pair of the second side walls and a pair of the second end walls extending from the second bottom walls for defining the second aperture, wherein at least one second external bias is placed on each of a pair of the second side walls and the second bottom wall has the second aperture array. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题:提供一种改进的EMC垫圈填料,用于在计算系统环境中屏蔽电气外壳的空槽。 解决方案:电磁垫圈填料20包括:具有一对第一侧壁36的第一导电壳30和从限定第一孔的第一底壁42延伸的一对第一端壁40,其中至少一个第一外壁 偏置被放置在一对第一侧壁中的每一个上,并且第一突片从一对第一端壁中的每一个延伸,其中第一底壁具有第一孔阵列和一对孔; 以及具有一对第二侧壁的第二导电壳60和从第二底壁延伸的一对第二端壁,用于限定第二孔,其中至少一个第二外部偏置放置在一对 第二侧壁和第二底壁具有第二孔径阵列。 版权所有(C)2009,JPO&INPIT

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