公开(公告)号：DE60041817D1

公开(公告)日：2009-04-30

申请号：DE60041817

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：PL201072B1

公开(公告)日：2009-03-31

申请号：PL35130500

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

公开(公告)号：ES2320523T3

公开(公告)日：2009-05-25

申请号：ES00931376

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

Abstract: Una estructura de interconexión que comprende una capa de cobre, una capa barrera, una capa de AlCu y una capa limitadora de almohadilla, en la que la capa de AlCu y la capa barrera están interpuestas entre la capa de cobre y la capa limitadora de almohadilla, y en la que la capa barrera está situada entre la capa de cobre y la capa de AlCu.

公开(公告)号：AT426247T

公开(公告)日：2009-04-15

申请号：AT00931376

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/485 ,  H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/532

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：PL351305A1

公开(公告)日：2003-04-07

申请号：PL35130500

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：HU0201473A2

公开(公告)日：2002-08-28

申请号：HU0201473

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：CZ20014145A3

公开(公告)日：2002-04-17

申请号：CZ20014145

申请日：2000-05-15

Applicant: IBM

Inventor： EDELSTEIN DANIEL ,  MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.

公开(公告)号：AU4933500A

公开(公告)日：2000-12-12

申请号：AU4933500

申请日：2000-05-15

Applicant: IBM

Inventor： MCGAHAY VINCENT ,  NYE HENRY ,  OTTEY BRIAN ,  PRICE WILLIAM

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532

Abstract: A structure comprising a layer of copper, a barrier layer, a layer of AlCu, and a pad-limiting layer, wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.