公开(公告)号：JPH10326809A

公开(公告)日：1998-12-08

申请号：JP10085198

申请日：1998-04-13

Applicant: IBM

Inventor： THOMAS M CARNEIN ,  MICHAEL A GAINES ,  RAMESCH R KODONANI ,  MARK V PEARSON ,  CHARLES G WOJTICK

IPC: H01L21/60 ,  H01L23/12 ,  H01L23/495

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor chip carrier assembly and its manufacturing method. SOLUTION: On a surface such as one connected electrically to a semiconductor chip 8, a flexible substrate 4 having a metallized path is provided. A reinforcing member 10 is provided near the flexible substrate 4 and jointed to the flexible substrate 4 with an adhesive composition 20. The adhesive composition 20 of a minute-hole film provided with a hardening bonding agent is provided between the flexible substrate 4 and the reinforcing member 10. A cover plate 14 is bonded to the semiconductor chip 8 and the reinforcing member 10 for jointing. By a method for manufacturing an assembly, a flexible substrate is arranged at a vacuum fixture. Here, with an adhesive composition and a reinforcing member provided, heat and pressure are applied to harden a hardening bonding agent.