公开(公告)号：DE3272282D1

公开(公告)日：1986-09-04

申请号：DE3272282

申请日：1982-04-27

Applicant: IBM

Inventor： AUG CONRAD JEAN ,  GUENTHER CHARLES JOSEPH ,  RANDOLPH JAMES BAYLISS

IPC: H05K1/18 ,  H01L23/32 ,  H01L23/40 ,  H01L23/52 ,  H05K1/00 ,  H05K3/32 ,  H05K3/36 ,  H05K1/14 ,  H05K3/40 ,  H01R9/09

Abstract: This circuit system accommodates the interconnection of a plurality of modules (32a, 33a), each containing a plurality of semiconductor chips, by means of a flexible printed circuit wiring assembly (6) containing contact pads (30b, 31b) and an interconnection wiring pattern. The modules contain a set of contact pads corresponding to the pads on the flexible wiring assembly and alignment pins to bring the abutting pads into registration. The pads on the flexible wiring assembly have a plurality of contact bumps to make better contact with the module packs. Clamping means (32d, 33d) is provided to retain the module and exert pressure on the contact pads.