公开(公告)号：IT1148807B

公开(公告)日：1986-12-03

申请号：IT2040780

申请日：1980-03-07

Applicant: IBM

Inventor： NARKEN BERNT ,  RAO RAMAMAHARA TUMMALA

IPC: H01L21/48 ,  H01L23/08 ,  H01L23/12 ,  H01L23/15 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  H01L

Abstract: A method for fabricating an interconnection package for a plurality of semiconductor chips which include the fabrication of a multi-layered glass-ceramic superstructure with a multi-layered distribution of conductors on a preformed multi-layered glass-ceramic base, by the repeatable steps of depositing a conductor pattern on the base and forming thereon a crystallizable glass dielectric layer which is then crystallized to a glass-ceramic prior to further additions of conductor patterns and crystallizable glass layers to form a monolithic compatible substrate all through. Semiconductor chips can be electrically connected to expose conductor patterns at the top surface of the resultant glass-ceramic package.